Inventor · disambiguated record
Kuo-Yuan Lee
Also filed as: LEE KUO-YUAN
7 granted patents·7 pending applications·28 citations·filing 2001–2012
81Inventor score
Top patents by PatentIndex Score
14 records- 0182US8093104B1Multi-chip stacking method to reduce voids between stacked chipsLEE KUO-YUAN·Filed 2011·Granted Jan 10, 2012·9 cites·17 claims
- 0271US8112854B2Tool holding device for a five-axis latheLEE KUO-YUAN·Filed 2010·Granted Feb 14, 2012·3 cites·5 claims
- 0369US7768112B2Semiconductor package fabricated by cutting and molding in small windowsWALTON ADVANCED ENG INC·Filed 2009·Granted Aug 3, 2010·4 cites·7 claims
- 0466US7723157B2Method for cutting and molding in small windows to fabricate semiconductor packagesWALTON ADVANCED ENG INC·Filed 2007·Granted May 25, 2010·3 cites·13 claims
- 0557US8361841B2Mold array process method to encapsulate substrate cut edgesWALTON ADVANCED ENG INC·Filed 2011·Granted Jan 29, 2013·1 cites·14 claims
- 0656US8815645B2Multi-chip stacking method to reduce voids between stacked chipsLEE KUO-YUAN·Filed 2011·Granted Aug 26, 2014·1 cites·15 claims
- 0754US6486564B2Heat dissipation module for a BGA ICWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Nov 26, 2002·7 cites·19 claims
- 0852US2013266923A1Interactive Multimedia Instructional System and DeviceLEE KUO-YUAN·Filed 2012·Application pending·0 cites
- 0943US2009134504A1Semiconductor package and packaging method for balancing top and bottom mold flows from windowWALTON ADVANCED ENG INC·Filed 2007·Application pending·0 cites
- 1043US2010219521A1Window type semiconductor packageLEE KUO-YUAN·Filed 2009·Application pending·0 cites
- 1136US2009294792A1Card type memory packageWALTON ADVANCED ENG INC·Filed 2008·Application pending·0 cites
- 1236US2012187598A1Method and apparatus of compression molding to reduce voids in molding compounds of semiconductor packagesLEE KUO-YUAN·Filed 2011·Application pending·0 cites
- 1334US2012077312A1Flip-chip bonding method to reduce voids in underfill materialLEE KUO-YUAN·Filed 2011·Application pending·0 cites
- 1434US2012264257A1Mold array process method to prevent exposure of substrate peripheriesLEE KUO-YUAN·Filed 2011·Application pending·0 cites
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