Inventor · disambiguated record
Kazuhiko Sugiura
Also filed as: SUGIURA KAZUHIKO
36 granted patents·8 pending applications·624 citations·filing 1994–2020
97Inventor score
Top patents by PatentIndex Score
44 records- 0196US6207302B1Electroluminescent device and method of producing the sameDENSO CORP·Filed 1998·Granted Mar 27, 2001·207 cites·24 claims
- 0293US5538352ATape printing systemBROTHER IND LTD·Filed 1994·Granted Jul 23, 1996·174 cites·15 claims
- 0392US7821085B2Physical quantity sensor and method for manufacturing the sameDENSO CORP·Filed 2009·Granted Oct 26, 2010·26 cites·12 claims
- 0490US7859091B2Manufacturing methods for semiconductor device with sealed capDENSO CORP·Filed 2008·Granted Dec 28, 2010·17 cites·25 claims
- 0589US7901967B2Dicing method for semiconductor substrateDENSO CORP·Filed 2006·Granted Mar 8, 2011·20 cites·21 claims
- 0688US8941122B2Silicon carbide semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2013·Granted Jan 27, 2015·7 cites·1 claims
- 0785US7968958B2Semiconductor device and manufacturing method of the sameDENSO CORP·Filed 2008·Granted Jun 28, 2011·9 cites·15 claims
- 0881US9105558B2Silicon carbide semiconductor device and manufacturing method of the sameDENSO CORP·Filed 2014·Granted Aug 11, 2015·4 cites·7 claims
- 0980US8004728B2Image scanning deviceBROTHER IND LTD·Filed 2007·Granted Aug 23, 2011·6 cites·19 claims
- 1079US9263267B2Silicon carbide semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2014·Granted Feb 16, 2016·3 cites·3 claims
- 1179US7598118B2Method of manufacturing semiconductor sensorDENSO CORP·Filed 2006·Granted Oct 6, 2009·7 cites·8 claims
- 1278US11101246B2Semiconductor device having chips attached to support members through silver sintered bodies with particlesDENSO CORP·Filed 2020·Granted Aug 24, 2021·1 cites·7 claims
- 1377US7214625B2Method for manufacturing movable portion of semiconductor deviceDENSO CORP·Filed 2004·Granted May 8, 2007·22 cites·56 claims
- 1473US8146426B2Physical sensorSUGIURA KAZUHIKO·Filed 2008·Granted Apr 3, 2012·7 cites·10 claims
- 1572US6090434AMethod for fabricating electroluminescent deviceNIPPON DENSO CO·Filed 1998·Granted Jul 18, 2000·25 cites·13 claims
- 1670US7662668B2Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrateDENSO CORP·Filed 2006·Granted Feb 16, 2010·3 cites·1 claims
- 1769US8785231B2Method of making semiconductor deviceDENSO CORP·Filed 2013·Granted Jul 22, 2014·2 cites·16 claims
- 1869US5714274AElectroluminescent device and method for producing the sameNIPPON DENSO CO·Filed 1996·Granted Feb 3, 1998·30 cites·20 claims
- 1968US8349634B2Semiconductor device with sealed capDENSO CORP·Filed 2010·Granted Jan 8, 2013·2 cites·2 claims
- 2067US8269290B2Semiconductor device including a plurality of semiconductor substrates and method of manufacturing the sameSUGIURA KAZUHIKO·Filed 2009·Granted Sep 18, 2012·4 cites·14 claims
- 2167US2008148467A1Hanger loop on inner side of pocket for preventing portable telephone, or the like, from fallingSUGIURA KAZUHIKO·Filed 2007·Application pending·0 cites
- 2266US8356259B2Information processing apparatus, information processing method and information recording mediumBROTHER IND LTD·Filed 2009·Granted Jan 15, 2013·3 cites·15 claims
- 2363US7157781B2Enhancement of membrane characteristics in semiconductor device with membraneDENSO CORP·Filed 2003·Granted Jan 2, 2007·11 cites·4 claims
- 2458US8728923B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2012·Granted May 20, 2014·1 cites·2 claims
- 2553US5667607AProcess for fabricating electroluminescent deviceNIPPON DENSO CO·Filed 1995·Granted Sep 16, 1997·15 cites·13 claims
- 2653US2010155865A1Semiconductor device and method of making the sameDENSO CORP·Filed 2009·Application pending·0 cites
- 2752US11189493B2Silicon carbide semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2019·Granted Nov 30, 2021·0 cites·7 claims
- 2849US10804237B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Oct 13, 2020·0 cites·4 claims
- 2949US8264051B2Semiconductor device and manufacturing method of the sameFUJII TETSUO·Filed 2011·Granted Sep 11, 2012·0 cites·8 claims
- 3048US8726268B2Computer-readable medium, information processing apparatus, display control methodSUGIURA KAZUHIKO·Filed 2009·Granted May 13, 2014·0 cites·15 claims
- 3147US10763204B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Sep 1, 2020·0 cites·6 claims
- 3247US2008198408A1Method of Controlling Computer and Printer for Printing System Capable of Executing Direct PrintingBROTHER IND LTD·Filed 2008·Application pending·0 cites
- 3347US2008218793A1Client Device of Direct Printing System and Computer-Readable Recording Medium Containing Utility Program for Direct PrintingBROTHER IND LTD·Filed 2008·Application pending·0 cites
- 3446US6824800B1Method of preparing a powder compositionTAIYO KAGAKU KK·Filed 1998·Granted Nov 30, 2004·13 cites·7 claims
- 3545US10441618B2Moringa extractSUGIURA KAZUHIKO·Filed 2016·Granted Oct 15, 2019·0 cites·4 claims
- 3644US10943847B2Semiconductor chip and semiconductor deviceDENSO CORP·Filed 2018·Granted Mar 9, 2021·0 cites·10 claims
- 3743US2007111484A1Dicing sheet frameDENSO CORP·Filed 2006·Application pending·0 cites
- 3843US2006220183A1Semiconductor wafer having multiple semiconductor elements and method for dicing the sameDENSO CORP·Filed 2006·Application pending·0 cites
- 3942US7547642B2Micro-structure manufacturing methodDENSO CORP·Filed 2005·Granted Jun 16, 2009·0 cites·24 claims
- 4042US5712051AElectroluminescent device and method for fabricating sameNIPPON DENSO CO·Filed 1995·Granted Jan 27, 1998·5 cites·10 claims
- 4141US2009194827A1Semiconductor Device Having Element Portion and Method of Producing the SameOGINO MASAHIRO·Filed 2006·Application pending·0 cites
- 4240US10361274B2Silicon carbide semiconductor device having metal silicide surrounds a peripheral of metal carbideDENSO CORP·Filed 2017·Granted Jul 23, 2019·0 cites·6 claims
- 4340US2007232107A1Cap attachment structure, semiconductor sensor device and methodDENSO CORP·Filed 2007·Application pending·0 cites
- 4436US9997432B2Semiconductor device and electronic component using the sameDENSO CORP·Filed 2015·Granted Jun 12, 2018·0 cites·10 claims
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