Inventor · disambiguated record
George Kostiew
Also filed as: KOSTIEW GEORGE · KOSTIEW GEORGE S
8 granted patents·38 citations·filing 2004–2016
84Inventor score
Top patents by PatentIndex Score
8 records- 0190US9282650B2Thermal compression bonding process cooling manifoldINTEL CORP·Filed 2013·Granted Mar 8, 2016·14 cites·13 claims
- 0282US9748199B2Thermal compression bonding process cooling manifoldINTEL CORP·Filed 2016·Granted Aug 29, 2017·4 cites·16 claims
- 0380US10297567B2Thermocompression bonding using plasma gasINTEL CORP·Filed 2015·Granted May 21, 2019·5 cites·23 claims
- 0480US7892883B2Clipless integrated heat spreader process and materialsINTEL CORP·Filed 2008·Granted Feb 22, 2011·9 cites·15 claims
- 0574US9943931B2High performance transient uniform cooling solution for thermal compression bonding processINTEL CORP·Filed 2016·Granted Apr 17, 2018·2 cites·8 claims
- 0666US9434029B2High performance transient uniform cooling solution for thermal compression bonding processLI ZHIHUA·Filed 2011·Granted Sep 6, 2016·2 cites·36 claims
- 0745US7367486B2System and method for forming solder jointsAGERE SYSTEMS INC·Filed 2004·Granted May 6, 2008·2 cites·7 claims
- 0838US8163598B2Clipless integrated heat spreader process and materialsKOSTIEW GEORGE·Filed 2011·Granted Apr 24, 2012·0 cites·6 claims
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