Inventor · disambiguated record
John E. Heidenreich, Iii
Also filed as: HEIDENREICH III JOHN E · HEIDENREICH III JOHN EDWARD
10 granted patents·627 citations·filing 1989–2004
92Inventor score
Files withIBM10
Top patents by PatentIndex Score
10 records- 0198US6187680B1Method/structure for creating aluminum wirebound pad on copper BEOLIBM·Filed 1998·Granted Feb 13, 2001·353 cites·19 claims
- 0294US5650032AApparatus for producing an inductive plasma for plasma processesIBM·Filed 1995·Granted Jul 22, 1997·92 cites·26 claims
- 0387US6333559B1Method/structure for creating aluminum wirebound pad on copper BEOLIBM·Filed 2000·Granted Dec 25, 2001·41 cites·15 claims
- 0487US5298720AMethod and apparatus for contamination control in processing apparatus containing voltage driven electrodeIBM·Filed 1990·Granted Mar 29, 1994·53 cites·30 claims
- 0581US5019210AMethod for enhancing the adhesion of polymer surfaces by water vapor plasma treatmentIBM·Filed 1989·Granted May 28, 1991·40 cites·16 claims
- 0667US6750113B2Metal-insulator-metal capacitor in copperIBM·Filed 2001·Granted Jun 15, 2004·12 cites·5 claims
- 0761US5340451AProcess for producing a metal organic polymer combinationIBM·Filed 1993·Granted Aug 23, 1994·22 cites·35 claims
- 0859US6339024B1Reinforced integrated circuitsIBM·Filed 2000·Granted Jan 15, 2002·8 cites·4 claims
- 0950US7087997B2Copper to aluminum interlayer interconnect using stud and via linerIBM·Filed 2001·Granted Aug 8, 2006·4 cites·8 claims
- 1047US7037824B2Copper to aluminum interlayer interconnect using stud and via linerIBM·Filed 2004·Granted May 2, 2006·2 cites·7 claims
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