Inventor · disambiguated record
Eckhard Ditzel
Also filed as: DITZEL ECKHARD
7 granted patents·2 pending applications·66 citations·filing 1994–2017
77Inventor score
Files withHERAEUS DEUTSCHLAND GMBH & CO KG2DITZEL ECKHARD1GESIPA BLINDNIETTECHNIK1KLEIN ANDREAS1KLEIN ANDREAS STEFFEN1
Top patents by PatentIndex Score
9 records- 0181US5496140ABlind rivets and method for its manufactureGESIPA BLINDNIETTECHNIK·Filed 1994·Granted Mar 5, 1996·62 cites·18 claims
- 0277US9048393B2Optoelectronic componentZITZLSPERGER MICHAEL·Filed 2010·Granted Jun 2, 2015·3 cites·17 claims
- 0352US9756730B2Chip-integrated through-plating of multi-layer substratesKLEIN ANDREAS STEFFEN·Filed 2011·Granted Sep 5, 2017·1 cites·10 claims
- 0441US10176420B2Strip-type substrate for producing chip card modulesHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Granted Jan 8, 2019·0 cites·16 claims
- 0539US9941197B2Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrateHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Granted Apr 10, 2018·0 cites·13 claims
- 0637US10468569B2Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection supportOSRAM GMBH·Filed 2016·Granted Nov 5, 2019·0 cites·18 claims
- 0735US2019097106A1Connection Carrier, Optoelectronic Component and Method for Producing a Connection Carrier or an Optoelectronic ComponentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Application pending·0 cites
- 0833US2013215584A1Laminate with integrated electronic componentKLEIN ANDREAS·Filed 2011·Application pending·0 cites
- 0932US8153232B2Laminated substrates for mounting electronic parts and methods for making sameDITZEL ECKHARD·Filed 2008·Granted Apr 10, 2012·0 cites·6 claims
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