Inventor · disambiguated record
Chien-Hua Tsai
Also filed as: TSAI CHIEN-HUA
9 granted patents·4 pending applications·66 citations·filing 1998–2012
85Inventor score
Top patents by PatentIndex Score
13 records- 0163US8546220B1Method for fabricating buried bit linesTANAKA ISAO·Filed 2012·Granted Oct 1, 2013·2 cites·10 claims
- 0248US6265274B1Method of a metal oxide semiconductor on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 24, 2001·16 cites·10 claims
- 0347US6191042B1Method of forming node contact openingUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 20, 2001·15 cites·13 claims
- 0445US6150223AMethod for forming gate spacers with different widthsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 21, 2000·16 cites·12 claims
- 0542US7598023B2Process for fabricating micro-displayUNITED MICROELECTRONICS CORP·Filed 2005·Granted Oct 6, 2009·0 cites·21 claims
- 0639US6204107B1Method for forming multi-layered liner on sidewall of node contact openingUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 20, 2001·9 cites·22 claims
- 0739US6159833AMethod of forming a contact hole in a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Dec 12, 2000·8 cites·9 claims
- 0837US2007093069A1Purge process after dry etchingTSAI CHIEN-HUA·Filed 2005·Application pending·0 cites
- 0934US2005193587A1Drying process for wafersFiled 2004·Application pending·0 cites
- 1027US8673730B2Manufacturing method of charging capacity structureHUNG PEI-CHUN·Filed 2011·Granted Mar 18, 2014·0 cites·8 claims
- 1126US2001014528A1Method of manufacturing unlanded via plugFiled 1998·Application pending·0 cites
- 1224US8613861B2Method of manufacturing vertical transistorsCHEN HSIAO-CHIA·Filed 2011·Granted Dec 24, 2013·0 cites·6 claims
- 1320US2013237044A1Method of manufacturing metal gatesCHEN HSIAO-CHIA·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →