Inventor · disambiguated record
Daniel P. Cram
Also filed as: CRAM DANIEL · CRAM DANIEL P
50 granted patents·6 pending applications·1,303 citations·filing 1997–2023
99Inventor score
Top patents by PatentIndex Score
56 records- 0199US6624653B1Method and system for wafer level testing and burning-in semiconductor componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 23, 2003·216 cites·24 claims
- 0297US6246108B1Integrated circuit package including lead frame with electrically isolated alignment featureMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 12, 2001·273 cites·20 claims
- 0397US6048744AIntegrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·275 cites·6 claims
- 0496US6462568B1Conductive polymer contact system and test method for semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 8, 2002·64 cites·20 claims
- 0595US6856151B1Conductive polymer contact system and test method for semiconductor componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·51 cites·20 claims
- 0695US6462575B1Method and system for wafer level testing and burning-in semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 8, 2002·53 cites·25 claims
- 0790US7114976B2Test socket and test system for semiconductor components with easily removable nestMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 3, 2006·16 cites·35 claims
- 0890US6727715B2Test system and test contactor for electronic modules having beam spring contactsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 27, 2004·28 cites·11 claims
- 0989US6888364B2Test system and test contactor for electronic modulesMICRON TECHNOLOGY INC·Filed 2004·Granted May 3, 2005·25 cites·18 claims
- 1089US6483329B1Test system, test contactor, and test method for electronic modulesMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 19, 2002·27 cites·12 claims
- 1187US6489794B1High speed pass through test system and test method for electronic modulesMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 3, 2002·27 cites·24 claims
- 1286US6756802B2Test system for electronic modules having contactors with spring segment terminal portionsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 29, 2004·24 cites·24 claims
- 1384US6825685B2Method and system for wafer level testing and burning-in semiconductor componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·20 cites·4 claims
- 1482US7514945B2Systems configured for utilizing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 7, 2009·8 cites·6 claims
- 1582US6998862B2Test socket for semiconductor components having serviceable nestMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 14, 2006·21 cites·30 claims
- 1681US6741091B2Test method for electronic modules using contractors and conductive polymer contactsMICRON TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·19 cites·20 claims
- 1778US7425839B2Systems and methods for testing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·8 cites·25 claims
- 1877US7456504B2Electronic component assemblies with electrically conductive bondsMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 25, 2008·5 cites·8 claims
- 1976US6836003B2Integrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 28, 2004·17 cites·8 claims
- 2074US7279915B2Test method for electronic modules using movable test contactorsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 9, 2007·4 cites·12 claims
- 2173US12499957B2Thermal conduction based batch testing systemMICRON TECHNOLOGY INC·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 2273US7265563B2Test method for semiconductor components using anisotropic conductive polymer contact systemMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 4, 2007·3 cites·17 claims
- 2372US8011092B2Methods of providing semiconductor components within socketsMICRON TECHNOLOGY INC·Filed 2008·Granted Sep 6, 2011·4 cites·7 claims
- 2472US7439752B2Methods of providing semiconductor components within socketsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 21, 2008·4 cites·9 claims
- 2572US7043388B2System and apparatus for testing packaged devices and related methodsMICRON TECHNOLOGY INC·Filed 2003·Granted May 9, 2006·15 cites·65 claims
- 2670US7918383B2Methods for placing substrates in contact with molten solderMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 5, 2011·2 cites·18 claims
- 2769US7586319B2Methods of retaining semiconductor component configurations within socketsMICRON TECHNOLOGY INC·Filed 2008·Granted Sep 8, 2009·3 cites·7 claims
- 2869US7135345B2Methods for processing semiconductor devices in a singulated formMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 14, 2006·8 cites·63 claims
- 2967US7541825B2Isolation circuitMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 2, 2009·2 cites·8 claims
- 3067US7176702B2Contact system for wafer level testingMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 13, 2007·10 cites·38 claims
- 3165US7427869B2Resilient contact probe apparatusMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 23, 2008·3 cites·20 claims
- 3265US7093622B2Apparatus for deforming resilient contact structures on semiconductor componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·7 cites·16 claims
- 3364US7126228B2Apparatus for processing semiconductor devices in a singulated formMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 24, 2006·7 cites·34 claims
- 3464US7123036B2Test method for electronic modulesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 17, 2006·6 cites·5 claims
- 3563US7570069B2Resilient contact probesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 4, 2009·3 cites·6 claims
- 3663US6966424B2Bladder based package control/singulationMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·8 cites·36 claims
- 3761US7122389B2Method for processing semiconductor devices in a singulated formMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 17, 2006·5 cites·9 claims
- 3859US8074353B2Methods of providing semiconductor components within socketsCRAM DANIEL P·Filed 2008·Granted Dec 13, 2011·2 cites·12 claims
- 3956US8004297B2Isolation circuitMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 23, 2011·0 cites·23 claims
- 4056US2008011815A1Methods for placing substrates in contact with molten solderMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 4153US7857646B2Electrical testing apparatus having masked sockets and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·4 cites·12 claims
- 4253US7274197B2Contact system for interfacing a semiconductor wafer to an electrical testerMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 25, 2007·1 cites·34 claims
- 4350US8063646B2Apparatus and methods for testing microelectronic devicesCRAM DANIEL P·Filed 2006·Granted Nov 22, 2011·2 cites·22 claims
- 4450US6585097B2Bladder based package control/singulationMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 1, 2003·3 cites·68 claims
- 4549US6858453B1Integrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 22, 2005·11 cites·12 claims
- 4648US7129721B2Method and apparatus for processing semiconductor devices in a singulated formHAMREN STEVEN L·Filed 2004·Granted Oct 31, 2006·3 cites·20 claims
- 4747US7038475B2Test method for semiconductor components using conductive polymer contact systemMICRON TECHNOLOGY INC·Filed 2003·Granted May 2, 2006·2 cites·20 claims
- 4846US7692437B2Systems and methods for testing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·0 cites·16 claims
- 4944US8624615B2Isolation circuitATTALLA HANI S·Filed 2011·Granted Jan 7, 2014·0 cites·20 claims
- 5044US2006131134A1Bladder based package control/singulationCRAM DANIEL P·Filed 2005·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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