Inventor · disambiguated record
Lu You
Also filed as: YOU LU
89 granted patents·3 pending applications·2,734 citations·filing 1992–2011
99Inventor score
Files withADVANCED MICRO DEVICES INC80SPANSION LLC4ADVANCED MICRO DEVICES INC AND SPANSION LLC1ADVANCED MICRO DEVICS INC1CHENG NING1
Top patents by PatentIndex Score
92 records- 0198US6893967B1L-shaped spacer incorporating or patterned using amorphous carbon or CVD organic materialsADVANCED MICRO DEVICES INC·Filed 2004·Granted May 17, 2005·246 cites·16 claims
- 0298US6773998B1Modified film stack and patterning strategy for stress compensation and prevention of pattern distortion in amorphous carbon gate patterningADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 10, 2004·208 cites·22 claims
- 0394US6566283B1Silane treatment of low dielectric constant materials in semiconductor device manufacturingADVANCED MICRO DEVICES INC·Filed 2002·Granted May 20, 2003·72 cites·18 claims
- 0494US6518167B1Method of forming a metal or metal nitride interface layer between silicon nitride and copperADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 11, 2003·81 cites·20 claims
- 0594US6030901APhotoresist stripping without degrading low dielectric constant materialsADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 29, 2000·151 cites·18 claims
- 0693US5268202AVapor deposition of parylene-F using 1,4-bis (trifluoromethyl) benzeneRENSSELAER POLYTECH INST·Filed 1992·Granted Dec 7, 1993·82 cites·22 claims
- 0792US7309650B1Memory device having a nanocrystal charge storage region and methodSPANSION LLC·Filed 2005·Granted Dec 18, 2007·22 cites·22 claims
- 0892US6750127B1Method for fabricating a semiconductor device using amorphous carbon having improved etch resistanceADVANCED MICRO DEVICES INC·Filed 2003·Granted Jun 15, 2004·61 cites·9 claims
- 0992US6147000AMethod for forming low dielectric passivation of copper interconnectsADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 14, 2000·138 cites·21 claims
- 1091US6764949B2Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabricationADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 20, 2004·53 cites·18 claims
- 1191US6756672B1Use of sic for preventing copper contamination of low-k dielectric layersADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 29, 2004·65 cites·7 claims
- 1291US6653735B1CVD silicon carbide layer as a BARC and hard mask for gate patterningADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 25, 2003·57 cites·3 claims
- 1390US6875664B1Formation of amorphous carbon ARC stack having graded transition between amorphous carbon and ARC materialADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 5, 2005·47 cites·20 claims
- 1489US6900002B1Antireflective bi-layer hardmask including a densified amorphous carbon layerADVANCED MICRO DEVICES INC·Filed 2002·Granted May 31, 2005·45 cites·7 claims
- 1589US6586842B1Dual damascene integration scheme for preventing copper contamination of dielectric layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 1, 2003·48 cites·11 claims
- 1688US6207552B1Forming and filling a recess in interconnect for encapsulation to minimize electromigrationADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 27, 2001·51 cites·12 claims
- 1786US7534732B1Semiconductor devices with copper interconnects and composite silicon nitride capping layersSPANSION LLC·Filed 2006·Granted May 19, 2009·12 cites·7 claims
- 1886US6407009B1Methods of manufacture of uniform spin-on filmsADVANCED MICRO DEVICES INC·Filed 1998·Granted Jun 18, 2002·74 cites·31 claims
- 1986US6235453B1Low-k photoresist removal processADVANCED MICRO DEVICES INC·Filed 1999·Granted May 22, 2001·78 cites·7 claims
- 2085US7378310B1Method for manufacturing a memory device having a nanocrystal charge storage regionSPANSION LLC·Filed 2005·Granted May 27, 2008·12 cites·20 claims
- 2185US6864556B1CVD organic polymer film for advanced gate patterningADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 8, 2005·30 cites·18 claims
- 2285US6713874B1Semiconductor devices with dual nature capping/arc layers on organic-doped silica glass inter-layer dielectricsADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 30, 2004·37 cites·9 claims
- 2385US6518646B1Semiconductor device with variable composition low-k inter-layer dielectric and method of makingADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 11, 2003·40 cites·14 claims
- 2485US6066574AHot plate cure process for BCB low k interlevel dielectricADVANCED MICRO DEVICES INC·Filed 1998·Granted May 23, 2000·75 cites·20 claims
- 2584US8415256B1Gap-filling with uniform propertiesNICKEL ALEXANDER·Filed 2010·Granted Apr 9, 2013·9 cites·14 claims
- 2684US6677679B1Use of SiO2/Sin for preventing copper contamination of low-k dielectric layersADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 13, 2004·37 cites·9 claims
- 2783US6383925B1Method of improving adhesion of capping layers to cooper interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·35 cites·10 claims
- 2883US6259115B1Dummy patterning for semiconductor manufacturing processesADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 10, 2001·69 cites·10 claims
- 2981US6663787B1Use of ta/tan for preventing copper contamination of low-k dielectric layersADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 16, 2003·32 cites·9 claims
- 3080US6803313B2Method for forming a hardmask employing multiple independently formed layers of a pecvd material to reduce pinholesADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 12, 2004·19 cites·11 claims
- 3179US7033960B1Multi-chamber deposition of silicon oxynitride film for patterningADVANCED MICRO DEVICES INC·Filed 2004·Granted Apr 25, 2006·22 cites·13 claims
- 3279US6689684B1Cu damascene interconnections using barrier/capping layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 10, 2004·27 cites·12 claims
- 3379US6576982B1Use of sion for preventing copper contamination of dielectric layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 10, 2003·27 cites·2 claims
- 3478US7256499B1Ultra low dielectric constant integrated circuit systemADVANCED MICRO DEVICES INC·Filed 2005·Granted Aug 14, 2007·8 cites·20 claims
- 3578US6309959B1Formation of self-aligned passivation for interconnect to minimize electromigrationADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 30, 2001·28 cites·19 claims
- 3677US7884030B1Gap-filling with uniform propertiesADVANCED MICRO DEVICES INC AND SPANSION LLC·Filed 2006·Granted Feb 8, 2011·7 cites·14 claims
- 3777US6492257B1Water vapor plasma for effective low-k dielectric resist strippingADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 10, 2002·22 cites·31 claims
- 3874US6724087B1Laminated conductive lines and methods of forming the sameADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 20, 2004·19 cites·24 claims
- 3973US6576545B1Semiconductor devices with dual nature capping/ARC layers on fluorine doped silica glass inter-layer dielectrics and method of forming capping/ARC layersADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 10, 2003·19 cites·20 claims
- 4072US6939793B1Dual damascene integration scheme for preventing copper contamination of dielectric layerADVANCED MICRO DEVICES INC·Filed 2003·Granted Sep 6, 2005·15 cites·12 claims
- 4172US6225240B1Rapid acceleration methods for global planarization of spin-on filmsADVANCED MICRO DEVICES INC·Filed 1998·Granted May 1, 2001·39 cites·20 claims
- 4271US6530340B2Apparatus for manufacturing planar spin-on filmsADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 11, 2003·38 cites·26 claims
- 4370US6699792B1Polymer spacers for creating small geometry space and method of manufacture thereofADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 2, 2004·13 cites·3 claims
- 4470US6596631B1Method of forming copper interconnect capping layers with improved interface and adhesionADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 22, 2003·17 cites·19 claims
- 4569US6632707B1Method for forming an interconnect structure using a CVD organic BARC to mitigate via poisoningADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 14, 2003·15 cites·8 claims
- 4668US6784095B1Phosphine treatment of low dielectric constant materials in semiconductor device manufacturingADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 31, 2004·14 cites·14 claims
- 4767US7521304B1Method for forming integrated circuitADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 21, 2009·9 cites·26 claims
- 4867US7208418B1Sealing sidewall pores in low-k dielectricsADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 24, 2007·13 cites·9 claims
- 4967US6317642B1Apparatus and methods for uniform scan dispensing of spin-on materialsADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 13, 2001·32 cites·22 claims
- 5066US6638358B1Method and system for processing a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 28, 2003·10 cites·3 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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