Inventor · disambiguated record
Yao-Fu Huang
Also filed as: Huang yao-fu
1 granted patent·3 pending applications·0 citations·filing 2020–2024
3Inventor score
Technology areasG06F
Files withDELL PRODUCTS LP4
Top patents by PatentIndex Score
4 records- 0150US2025244803A1Carrier module to provide a thermal solution for stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 0250US2025247983A1Carrier module for grounding stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 0350US2025244802A1Carrier module for stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 0438US11294845B2Information handling system memory module expanderDELL PRODUCTS LP·Filed 2020·Granted Apr 5, 2022·0 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →