Inventor · disambiguated record

Yuta Sagawa

Also filed as: SAGAWA YUTA

1 granted patent·0 citations·filing 2015–2015

8Inventor score

Technology areasH10P

Files withLINTEC CORP1

Top patents by PatentIndex Score

1 record

0133US9953946B2Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor deviceLINTEC CORP·Filed 2015·Granted Apr 24, 2018·0 cites·5 claims

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