Inventor · disambiguated record
Miguel A. Jimarez
Also filed as: JIMAREZ MIGUEL · JIMAREZ MIGUEL A · JIMAREZ MIGUEL ANGEL
41 granted patents·4 pending applications·1,238 citations·filing 1995–2013
98Inventor score
Top patents by PatentIndex Score
45 records- 0198US6497943B1Surface metal balancing to reduce chip carrier flexingIBM·Filed 2000·Granted Dec 24, 2002·162 cites·17 claims
- 0297US7898093B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 1, 2011·50 cites·8 claims
- 0396US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 0495US8476748B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2012·Granted Jul 2, 2013·15 cites·20 claims
- 0593US6664637B2Flip chip C4 extension structure and processIBM·Filed 2001·Granted Dec 16, 2003·63 cites·26 claims
- 0692US8847372B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 30, 2014·8 cites·20 claims
- 0792US6583517B1Method and structure for joining two substrates with a low melt solder jointIBM·Filed 2002·Granted Jun 24, 2003·74 cites·19 claims
- 0891US8368194B1Exposed die overmolded flip chip packageAMKOR TECHNOLOGY INC·Filed 2012·Granted Feb 5, 2013·8 cites·17 claims
- 0990US8541260B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 24, 2013·7 cites·20 claims
- 1090US5729440ASolder hierarchy for chip attachment to substratesIBM·Filed 1997·Granted Mar 17, 1998·100 cites·5 claims
- 1190US5542601ARework process for semiconductor chips mounted in a flip chip configuration on an organic substrateIBM·Filed 1995·Granted Aug 6, 1996·145 cites·10 claims
- 1289US6407334B1I/C chip assemblyIBM·Filed 2000·Granted Jun 18, 2002·35 cites·13 claims
- 1387US6225206B1Flip chip C4 extension structure and processIBM·Filed 1999·Granted May 1, 2001·67 cites·17 claims
- 1486US6756680B2Flip chip C4 extension structure and processIBM·Filed 2001·Granted Jun 29, 2004·33 cites·20 claims
- 1585US6955982B2Flip chip C4 extension structure and processIBM·Filed 2003·Granted Oct 18, 2005·29 cites·21 claims
- 1684US7353590B2Method of forming printed circuit cardIBM·Filed 2005·Granted Apr 8, 2008·10 cites·15 claims
- 1779US8207022B1Exposed die overmolded flip chip package methodDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Jun 26, 2012·3 cites·20 claims
- 1879US6757967B2Method of forming a chip assemblyIBM·Filed 2002·Granted Jul 6, 2004·18 cites·12 claims
- 1979US6486415B2Compliant layer for encapsulated columnsIBM·Filed 2001·Granted Nov 26, 2002·20 cites·2 claims
- 2076US6818972B2Reduction of chip carrier flexing during thermal cyclingIBM·Filed 2002·Granted Nov 16, 2004·16 cites·20 claims
- 2176US6750405B1Two signal one power plane circuit boardIBM·Filed 2000·Granted Jun 15, 2004·19 cites·2 claims
- 2271US6528179B1Reduction of chip carrier flexing during thermal cyclingIBM·Filed 2000·Granted Mar 4, 2003·12 cites·18 claims
- 2368US7270478B2X-ray alignment system for fabricating electronic chipsIBM·Filed 2005·Granted Sep 18, 2007·2 cites·9 claims
- 2468US6492600B1Laminate having plated microvia interconnects and method for forming the sameIBM·Filed 1999·Granted Dec 10, 2002·28 cites·16 claims
- 2567US6246124B1Encapsulated chip module and method of making sameIBM·Filed 1998·Granted Jun 12, 2001·30 cites·10 claims
- 2667US5909838AMethod of solder removalIBM·Filed 1997·Granted Jun 8, 1999·24 cites·22 claims
- 2766US8912051B1Method for controlling molding compound geometry around a semiconductor dieSYED AHMER·Filed 2012·Granted Dec 16, 2014·3 cites·20 claims
- 2866US6194667B1Receptor pad structure for chip carriersIBM·Filed 1998·Granted Feb 27, 2001·28 cites·6 claims
- 2963US2008043909A1X-Ray Alignment System For Fabricating Electronic ChipsIBM·Filed 2007·Application pending·0 cites
- 3062US7278207B2Method of making an electronic packageIBM·Filed 2005·Granted Oct 9, 2007·1 cites·5 claims
- 3158US6986198B2Method of forming printed circuit cardIBM·Filed 2003·Granted Jan 17, 2006·6 cites·6 claims
- 3258US6558981B2Method for making an encapsulated semiconductor chip moduleIBM·Filed 2001·Granted May 6, 2003·7 cites·8 claims
- 3354US6524888B2Method of attaching a conformal chip carrier to a flip chipIBM·Filed 2002·Granted Feb 25, 2003·6 cites·11 claims
- 3453US2007278654A1Method of making an electronic packageJIMAREZ LISA J·Filed 2007·Application pending·0 cites
- 3552US6961995B2Method of making an electronic packageIBM·Filed 2002·Granted Nov 8, 2005·3 cites·3 claims
- 3650US5655703ASolder hierarchy for chip attachment to substratesIBM·Filed 1995·Granted Aug 12, 1997·14 cites·10 claims
- 3749US2008017410A1Method for forming a plated microvia interconnectJIMAREZ MIGUEL A·Filed 2007·Application pending·0 cites
- 3847US7328506B2Method for forming a plated microvia interconnectIBM·Filed 2002·Granted Feb 12, 2008·2 cites·14 claims
- 3946US6223968B1Solder bonding/debonding nozzle insertIBM·Filed 2000·Granted May 1, 2001·2 cites·4 claims
- 4042US2004032931A1X-ray alignment system for fabricaing electronic chipsIBM·Filed 2002·Application pending·0 cites
- 4140US6989607B2Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriersIBM·Filed 2003·Granted Jan 24, 2006·0 cites·12 claims
- 4239US6639302B2Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carriesIBM·Filed 2002·Granted Oct 28, 2003·0 cites·25 claims
- 4339US5810241ASolder bonding/debonding nozzle insertIBM·Filed 1996·Granted Sep 22, 1998·7 cites·9 claims
- 4438US6337509B2Fixture for attaching a conformal chip carrier to a flip chipIBM·Filed 1998·Granted Jan 8, 2002·7 cites·11 claims
- 4527US6082608ASolder bonding/debonding nozzle insertIBM·Filed 1998·Granted Jul 4, 2000·1 cites·9 claims
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