Inventor · disambiguated record
Claude Blais
Also filed as: BLAIS CLAUDE
4 granted patents·2 pending applications·28 citations·filing 1993–2010
72Inventor score
Files withIBM6
Top patents by PatentIndex Score
6 records- 0148US7771541B2Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfacesIBM·Filed 2007·Granted Aug 10, 2010·0 cites·19 claims
- 0247US6904673B1Control of flux by ink stop line in chip joiningIBM·Filed 2002·Granted Jun 14, 2005·6 cites·14 claims
- 0346US5457299ASemiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chipIBM·Filed 1993·Granted Oct 10, 1995·17 cites·8 claims
- 0442US2010218894A1Method of Removing Metallic, Inorganic and Organic Contaminants From Chip Passivation Layer SurfacesIBM·Filed 2010·Application pending·0 cites
- 0540US2007099346A1Surface treatments for underfill controlIBM·Filed 2005·Application pending·0 cites
- 0630US6112976AMethod of manufacturing wire segments of homogeneous compositionIBM·Filed 1998·Granted Sep 5, 2000·5 cites·13 claims
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