Inventor · disambiguated record
Babak Sabi
Also filed as: SABI BABAK
4 granted patents·2 pending applications·68 citations·filing 1995–2022
76Inventor score
Files withINTEL CORP6
Top patents by PatentIndex Score
6 records- 0182US5732207AMicroprocessor having single poly-silicon EPROM memory for programmably controlling optional featuresINTEL CORP·Filed 1995·Granted Mar 24, 1998·54 cites·11 claims
- 0281US9865568B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2015·Granted Jan 9, 2018·3 cites·20 claims
- 0377US10424561B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2018·Granted Sep 24, 2019·2 cites·25 claims
- 0452US2023343769A1Packaging architecture for wafer-scale known-good-die to known-good-die hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0540US2020098725A1Semiconductor package or semiconductor package structure with dual-sided interposer and memoryINTEL CORP·Filed 2018·Application pending·0 cites
- 0635US5852712AMicroprocessor having single poly-silicon EPROM memory for programmably controlling optional featuresINTEL CORP·Filed 1997·Granted Dec 22, 1998·9 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →