Inventor · disambiguated record

Mark M. Nakamoto

Also filed as: NAKAMOTO MARK · NAKAMOTO MARK M

1 granted patent·1 pending application·1 citations·filing 2009–2010

16Inventor score

Technology areasH10P H10W

Files withHENDERSON BRIAN MATTHEW1 QUALCOMM INC1

Top patents by PatentIndex Score

2 records

0150US8618539B2Interconnect sensor for detecting delaminationHENDERSON BRIAN MATTHEW·Filed 2009·Granted Dec 31, 2013·1 cites·18 claims
0228US2011221053A1Pre-processing to reduce wafer level warpageQUALCOMM INC·Filed 2010·Application pending·0 cites

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