Inventor · disambiguated record
Saburo Miyamoto
Also filed as: MIYAMOTO SABURO
19 granted patents·6 pending applications·467 citations·filing 1978–2011
94Inventor score
Top patents by PatentIndex Score
25 records- 0196US8031180B2Touch sensor, display with touch sensor, and method for generating position dataSHARP KK·Filed 2002·Granted Oct 4, 2011·142 cites·19 claims
- 0290US5891298AMethod and apparatus for peeling protective adhesive tape from semiconductor waferNITTO DENKO CORP·Filed 1996·Granted Apr 6, 1999·125 cites·15 claims
- 0383US5759006ASemiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewithNITTO DENKO CORP·Filed 1996·Granted Jun 2, 1998·74 cites·4 claims
- 0481US8395595B2Touch sensor, display device with touch sensor, and method of generating location dataMIYAMOTO SABURO·Filed 2011·Granted Mar 12, 2013·8 cites·8 claims
- 0578US6272814B1Method of packaging nut assembliesWAKAI SANGYO KK·Filed 2000·Granted Aug 14, 2001·28 cites·1 claims
- 0672US7849900B2Apparatus for joining a separating adhesive tapeNITTO DENKO CORP·Filed 2006·Granted Dec 14, 2010·4 cites·9 claims
- 0772US7384811B2Method of separating semiconductor wafer, and separating apparatus using the sameNITTO DENKO CORP·Filed 2004·Granted Jun 10, 2008·16 cites·10 claims
- 0870US7387951B2Method of dicing semiconductor wafer into chips, and apparatus using this methodNITTO DENKO CORP·Filed 2005·Granted Jun 17, 2008·3 cites·8 claims
- 0964US7393757B2Method for separating semiconductor wafer from supporting member, and apparatus using the sameNITTO DENKO CORP·Filed 2004·Granted Jul 1, 2008·10 cites·4 claims
- 1059US8349106B2Adhesive tape joining method and adhesive tape joining apparatusNITTO DENKO CORP·Filed 2010·Granted Jan 8, 2013·1 cites·5 claims
- 1156US6235144B1Resist removing apparatus and methodNITTO DENKO CORP·Filed 1998·Granted May 22, 2001·21 cites·13 claims
- 1252US4204905ATaping machineNITTO ELECTRIC IND CO·Filed 1978·Granted May 27, 1980·10 cites·3 claims
- 1350US7913735B2Adhesive tape joining apparatusNITTO DENKO CORP·Filed 2009·Granted Mar 29, 2011·0 cites·10 claims
- 1447US8097121B2Protective tape separation method and protective tape separation apparatusYAMAMOTO MASAYUKI·Filed 2008·Granted Jan 17, 2012·0 cites·9 claims
- 1547US8062474B2Protective tape separation method and apparatus using the sameYAMAMOTO MASAYUKI·Filed 2008·Granted Nov 22, 2011·0 cites·27 claims
- 1647US7984737B2Adhesive tape cutting method and adhesive tape joining apparatus using the sameNITTO DENKO CORP·Filed 2007·Granted Jul 26, 2011·0 cites·4 claims
- 1746US5688090AScrew assemblyWAKAI SANGYO KK·Filed 1996·Granted Nov 18, 1997·16 cites·2 claims
- 1845US7078316B2Substrate joining apparatusNITTO DENKO CORP·Filed 2004·Granted Jul 18, 2006·1 cites·10 claims
- 1943US2008099253A1Coordinate Detecting Apparatus, Display Apparatus and Coordinate Detecting MethodSHARP KK·Filed 2005·Application pending·0 cites
- 2042US6099675AResist removing methodNITTO DENKO CORP·Filed 1998·Granted Aug 8, 2000·8 cites·20 claims
- 2139US2012160397A1Mounted wafer manufacturing methodYAMAMOTO MASAYUKI·Filed 2011·Application pending·0 cites
- 2239US2010038009A1Method and apparatus for joining protective tape to semiconductor waferOKUNO CHOUHEI·Filed 2009·Application pending·0 cites
- 2338US2011232841A1Semiconductor wafer mounting method and semiconductor wafer mounting apparatusYAMAMOTO MASAYUKI·Filed 2011·Application pending·0 cites
- 2432US2011045234A1Method and configuration for reinforcing plate materialMIYAMOTO SABURO·Filed 2010·Application pending·0 cites
- 2532US2011056615A1Adhesive tape joining method and adhesive tape joining apparatusMIYAMOTO SABURO·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →