Inventor · disambiguated record
Keith Lee Moore
Also filed as: MOORE KEITH · MOORE KEITH L · MOORE KEITH LEE
7 granted patents·3 pending applications·75 citations·filing 1999–2016
85Inventor score
Top patents by PatentIndex Score
10 records- 0193US7221554B2Method of electrolytic deposition of an intrinsically conductive polymer upon a non-conductive substrateKEMET ELECTRONICS CORP·Filed 2005·Granted May 22, 2007·33 cites·9 claims
- 0270US6375710B2Process for producing powder metallurgy compacts free from binder contamination and compacts produced therebyKEMET ELECTRONICS CORP·Filed 2000·Granted Apr 23, 2002·9 cites·4 claims
- 0365US8848343B2Solid electrolytic capacitor and method for manufacturing the sameJACOBS DAVID·Filed 2012·Granted Sep 30, 2014·2 cites·17 claims
- 0465US6591515B2Mobile incline kinetic evaporatorKEMET ELECTRONICS CORP·Filed 2001·Granted Jul 15, 2003·9 cites·11 claims
- 0562US6485676B1Atmospheric pressure method of thermally removing binder from porous compacts and binder-free compacts produced therebyKEMET ELECTRONICS CORP·Filed 2000·Granted Nov 26, 2002·7 cites·16 claims
- 0650US6319459B1Removal of organic acid based binders from powder metallurgy compactsKEMET ELECTRONICS CORP·Filed 1999·Granted Nov 20, 2001·12 cites·16 claims
- 0745US2015056342A1Package With Ridged Dome And Methods Of Making And Using The SameCRYOVAC INC·Filed 2013·Application pending·0 cites
- 0839US2017084397A1Methods to Reduce Case Height for CapacitorsKEMET ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 0936US2004231119A1Method of electrolytic deposition of an intrinsically conductive polymer upon a non-conductive substrateFiled 2003·Application pending·0 cites
- 1034US6315808B1Process for producing powder metallurgy compacts free from binder contamination and compacts produced therebyKEMET ELECTRONICS CORP·Filed 1999·Granted Nov 13, 2001·3 cites·15 claims
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