Inventor · disambiguated record
Toshiaki Murao
Also filed as: MURAO TOSHIAKI
4 granted patents·73 citations·filing 1983–1993
77Inventor score
Top patents by PatentIndex Score
4 records- 0172US4461348AHeat exchangerNIPPON DENSO CO·Filed 1983·Granted Jul 24, 1984·34 cites·12 claims
- 0269US5011547AAluminum alloy composite material for brazingKOBE STEEL LTD·Filed 1989·Granted Apr 30, 1991·28 cites·12 claims
- 0332US5349219AWafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit deviceFUJITSU LTD·Filed 1993·Granted Sep 20, 1994·5 cites·16 claims
- 0430US5032889AWiring structure in a wafer-scale integrated circuitFUJITSU LTD·Filed 1990·Granted Jul 16, 1991·6 cites·7 claims
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