Inventor · disambiguated record
Bokyeong Hwang
Also filed as: HWANG BOKYEONG
3 granted patents·1 pending application·1 citations·filing 2021–2025
51Inventor score
Technology areasH10W
Files withSTATS CHIPPAC PTE LTD4
Top patents by PatentIndex Score
4 records- 0183US11776861B2Compartment shielding with metal frame and capSTATS CHIPPAC PTE LTD·Filed 2021·Granted Oct 3, 2023·1 cites·13 claims
- 0272US2025357286A1Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect SubstrateSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0368US12412792B2Compartment shielding with metal frame and capSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 9, 2025·0 cites·24 claims
- 0464US12400941B2Semiconductor device and method of disposing electrical components over side surfaces of interconnect substrateSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 26, 2025·0 cites·32 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →