Inventor · disambiguated record
Zhaosheng Meng
Also filed as: MENG ZHAOSHENG
5 granted patents·0 citations·filing 2021–2022
58Inventor score
Top patents by PatentIndex Score
5 records- 0156US11978702B2Simultaneous self-forming hea barrier and Cu seeding layers for Cu interconnectSIEN QINGDAO INTEGRATED CIRCUITS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·10 claims
- 0252US12131946B2Method to form contacts with multiple depth by enhanced CESLSIEN QINGDAO INTEGRATED CIRCUITS CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·8 claims
- 0351US12243773B2Liner and barrier layer in dual damascene cu interconnect for enhanced EM and processSIEN QINGDAO INTEGRATED CIRCUITS CO LTD·Filed 2021·Granted Mar 4, 2025·0 cites·6 claims
- 0449US11834754B2ALD method with multi-chambers for sic or multi-elements epitaxial growthSIEN QINGDAO INTEGRATED CIRCUITS CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·17 claims
- 0533US11860650B1Method for monitoring and controlling supporting posture of supporting-type hydraulic supportUNIV SHANDONG SCIENCE & TECH·Filed 2022·Granted Jan 2, 2024·0 cites·10 claims
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