Inventor · disambiguated record
Jisong Jin
Also filed as: JIN JISONG
30 granted patents·27 pending applications·9 citations·filing 2019–2024
92Inventor score
Top patents by PatentIndex Score
57 records- 0196US11637092B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Apr 25, 2023·4 cites·12 claims
- 0287US12328904B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2022·Granted Jun 10, 2025·1 cites·10 claims
- 0382US12096696B2Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Sep 17, 2024·1 cites·14 claims
- 0482US11355351B2Semiconductor device and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Jun 7, 2022·2 cites·15 claims
- 0573US2025015081A1Fabrication method of semiconductor structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 0671US12341022B2Semiconductor device and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2022·Granted Jun 24, 2025·0 cites·15 claims
- 0771US11742355B2Semiconductor structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2022·Granted Aug 29, 2023·0 cites·10 claims
- 0871US11183384B2Semiconductor device and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2019·Granted Nov 23, 2021·1 cites·20 claims
- 0969US11810903B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Granted Nov 7, 2023·0 cites·11 claims
- 1067US12387773B2Magnetic random access memory cell and memorySEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Granted Aug 12, 2025·0 cites·10 claims
- 1167US12376328B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Granted Jul 29, 2025·0 cites·6 claims
- 1264US11437378B2Semiconductor structure and formation method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Sep 6, 2022·0 cites·13 claims
- 1363US2025046776A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 1463US2025191936A1Package structure and packging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 1563US2025391669A1Method of forming semiconductor structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 1662US2025079391A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 1762US2025040159A1Metal-insulator-metal capacitor structure and method form forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 1861US2025351447A1Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 1960US11626497B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Apr 11, 2023·0 cites·12 claims
- 2060US11443955B2Semiconductor device and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Sep 13, 2022·0 cites·14 claims
- 2160US2024266289A1Semiconductor structure and method of forming semiconductor structureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2024·Application pending·0 cites
- 2259US2024186253A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2359US2024186233A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2458US2024178203A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2558US2022028855A1Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Application pending·0 cites
- 2658US2024178186A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2758US2024113157A1Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2857US2024006515A1Semiconductor structure and forming method thereof, and photomask layoutSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 2956US2023282570A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3055US2023411444A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3155US2023352417A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3255US2023352468A1Packaging structure and packaging methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3355US2023352467A1Packaging structure and packaging methodSEMICONDUCTOR MFG INTEMATIONAL SHANGHAI CORPORATION·Filed 2023·Application pending·0 cites
- 3454US2024274466A1Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3554US2023292483A1Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INTEMATIONAL SHANGHAI CORPORATION·Filed 2023·Application pending·0 cites
- 3654US2023299075A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3753US11664234B2Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted May 30, 2023·0 cites·19 claims
- 3853US2024313042A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Application pending·0 cites
- 3952US11809802B2Process manufacturing method, method for adjusting threshold voltage device, and storage mediumSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Nov 7, 2023·0 cites·26 claims
- 4052US11721553B2Formation method of semiconductor device using mask layer and sidewall spacer material layer to form trenchesSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Aug 8, 2023·0 cites·12 claims
- 4151US11239088B2Semiconductor device and formation method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 4250US12087582B2Improving resolution of masks for semiconductor manufactureSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Sep 10, 2024·0 cites·16 claims
- 4350US11651964B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted May 16, 2023·0 cites·11 claims
- 4450US2023056668A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2022·Application pending·0 cites
- 4549US11810787B2Semiconductor structure formation method and maskSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 4649US11769672B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Sep 26, 2023·0 cites·18 claims
- 4749US11631743B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Apr 18, 2023·0 cites·16 claims
- 4849US11631744B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Apr 18, 2023·0 cites·16 claims
- 4948US12080596B2Semiconductor structure and forming method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Sep 3, 2024·0 cites·12 claims
- 5048US11769691B2Semiconductor device and formation method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Granted Sep 26, 2023·0 cites·10 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →