Inventor · disambiguated record
Ping Ping Ooi
Also filed as: OOI PING PING
18 granted patents·5 pending applications·26 citations·filing 2012–2024
90Inventor score
Top patents by PatentIndex Score
23 records- 0192US11121074B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Sep 14, 2021·3 cites·7 claims
- 0287US10593618B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 17, 2020·3 cites·7 claims
- 0383US11521932B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 6, 2022·1 cites·21 claims
- 0483US10998261B2Over-molded IC package with in-mold capacitorINTEL CORP·Filed 2018·Granted May 4, 2021·4 cites·8 claims
- 0581US10388636B2Integrating system in package (SIP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2015·Granted Aug 20, 2019·3 cites·25 claims
- 0679US2024395722A1Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0778US12142570B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 0878US11164827B2Substrate with gradiated dielectric for reducing impedance mismatchINTEL CORP·Filed 2017·Granted Nov 2, 2021·2 cites·17 claims
- 0977US8890302B2Hybrid package transmission line circuitsKONG CHUNG PENG JACKSON·Filed 2012·Granted Nov 18, 2014·6 cites·23 claims
- 1069US12002793B2Integrating system in package (SiP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2021·Granted Jun 4, 2024·0 cites·8 claims
- 1168US11837458B2Substrate with gradiated dielectric for reducing impedance mismatchINTEL CORP·Filed 2021·Granted Dec 5, 2023·0 cites·18 claims
- 1267US10317938B2Apparatus utilizing computer on package constructionINTEL CORP·Filed 2015·Granted Jun 11, 2019·2 cites·22 claims
- 1366US10541200B2Over-molded IC packages with embedded voltage reference plane and heater spreaderINTEL CORP·Filed 2018·Granted Jan 21, 2020·1 cites·15 claims
- 1463US10403604B2Stacked package assembly with voltage reference planeINTEL CORP·Filed 2015·Granted Sep 3, 2019·1 cites·18 claims
- 1560US11114421B2Integrating system in package (SiP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2019·Granted Sep 7, 2021·0 cites·17 claims
- 1653US9543244B2Hybrid package transmission line circuitsINTEL CORP·Filed 2014·Granted Jan 10, 2017·0 cites·22 claims
- 1749US11355458B2Interconnect coreINTEL CORP·Filed 2017·Granted Jun 7, 2022·0 cites·8 claims
- 1846US10916524B2Stacked dice systemsINTEL CORP·Filed 2017·Granted Feb 9, 2021·0 cites·17 claims
- 1945US10980108B2Multi-conductor interconnect structure for a microelectronic deviceINTEL CORP·Filed 2017·Granted Apr 13, 2021·0 cites·22 claims
- 2043US2020027813A1Microelectronics package with a combination heat spreader/radio frequency shieldINTEL CORP·Filed 2019·Application pending·0 cites
- 2138US2018226357A1Embedded voltage reference plane for system-in-package applicationsINTEL CORP·Filed 2018·Application pending·0 cites
- 2237US2019311978A1Composite stacked interconnects for high-speed applications and methods of assembling sameINTEL CORP·Filed 2019·Application pending·0 cites
- 2330US2017086298A1Substrate including structures to couple a capacitor to a packaged device and method of making sameCHUAH TIN POAY·Filed 2015·Application pending·0 cites
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