Inventor · disambiguated record

Mohd Fauzi Hj Mahat

Also filed as: HJ MAHAT MOHD FAUZI

1 granted patent·5 citations·filing 2005–2005

25Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG1

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1 record

0164US7791182B2Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producingINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 7, 2010·5 cites·17 claims

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Mohd Fauzi Hj Mahat — Patent Inventor | PatentIndex