Inventor · disambiguated record
Thomas J. Grobelny
Also filed as: GROBELNY THOMAS J
1 granted patent·2 pending applications·35 citations·filing 2002–2014
48Inventor score
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3 records- 0183US7307775B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 11, 2007·35 cites·161 claims
- 0247US2008096313A1Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer SubstratesTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 0345US2015174881A1Rf node welding of corrugated honeycomb coreC & D ZODIAC INC·Filed 2014·Application pending·0 cites
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