Inventor · disambiguated record
Tae-Hyeog Kang
Also filed as: KANG TAE HYEOG
2 granted patents·1 pending application·15 citations·filing 2003–2009
57Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRO MECH3
Top patents by PatentIndex Score
3 records- 0169US7960822B2Package on package substrateSAMSUNG ELECTRO MECH·Filed 2009·Granted Jun 14, 2011·6 cites·7 claims
- 0255US7065869B2Method for plating of printed circuit board stripSAMSUNG ELECTRO MECH·Filed 2003·Granted Jun 27, 2006·9 cites·19 claims
- 0336US2007241438A1Strip format of package board and array of the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →