Inventor · disambiguated record

Ryan H. Lewis

Also filed as: LEWIS RYAN · LEWIS RYAN H

1 granted patent·1 pending application·2 citations·filing 2017–2025

18Inventor score

Technology areasG06F H10H

Files withAYASDI INC1 UNIV MCMASTER1

Top patents by PatentIndex Score

2 records

0175US2025366262A1Ultra-thin strain-relieving si1-xgex layers enabling iii-v epitaxy on siUNIV MCMASTER·Filed 2025·Application pending·0 cites
0259US10417262B2Scalable topological data analysisAYASDI INC·Filed 2017·Granted Sep 17, 2019·2 cites·23 claims

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