Inventor · disambiguated record
Mai Ogasawara
Also filed as: OGASAWARA MAI
1 granted patent·1 pending application·1 citations·filing 2013–2018
16Inventor score
Technology areasH10P
Top patents by PatentIndex Score
2 records- 0158US9455229B2Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor elementNAMIKI PRECISION JEWEL CO LTD·Filed 2013·Granted Sep 27, 2016·1 cites·6 claims
- 0233US2019148132A1Method of manufacturing small-diameter waferDISCO CORP·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →