Inventor · disambiguated record
Chia-Hung Huang
Also filed as: HUANG CHIA-HUNG
38 granted patents·22 pending applications·119 citations·filing 1996–2022
96Inventor score
Files withADVANCED OPTOELECTRONIC TECH8CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD8HUANG CHIA-HUNG7METAL IND RES & DEV CT7TU PO-MIN6
Top patents by PatentIndex Score
60 records- 0188US5732536ATape roll in-series package machineIND TECH RES INST·Filed 1996·Granted Mar 31, 1998·75 cites·9 claims
- 0280US8082055B2Method for a bin ratio forecast at new tape out stageLIN CHUN-HSIEN·Filed 2009·Granted Dec 20, 2011·7 cites·20 claims
- 0378US9040328B2Manufacturing method for an LEDZHONGSHAN INNOCLOUD IP SERVICES CO LTD·Filed 2014·Granted May 26, 2015·2 cites·10 claims
- 0478US8349742B2Gallium nitride-based semiconductor device and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Jan 8, 2013·3 cites·8 claims
- 0577US8604503B2Light emitting diode and manufacturing method thereofHUANG CHIA-HUNG·Filed 2012·Granted Dec 10, 2013·2 cites·20 claims
- 0675US9831153B1Heat dissipating deviceMETAL IND RES & DEV CT·Filed 2016·Granted Nov 28, 2017·3 cites·12 claims
- 0775US8754438B2Light emitting diodeLIN YA-WEN·Filed 2012·Granted Jun 17, 2014·2 cites·7 claims
- 0873US8461666B2Gallium nitride-based semiconductor device and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2012·Granted Jun 11, 2013·2 cites·11 claims
- 0972US8536590B2Light emitting element packageHUANG SHIH-CHENG·Filed 2011·Granted Sep 17, 2013·3 cites·11 claims
- 1072US8501582B2Semiconductor structure having low thermal stress and method for manufacturing thereofHUANG SHIH-CHENG·Filed 2010·Granted Aug 6, 2013·2 cites·8 claims
- 1170US8466033B2Light emitting diode and manufacturing method thereofTU PO-MIN·Filed 2011·Granted Jun 18, 2013·2 cites·11 claims
- 1268US8946737B2Light emitting diode and manufacturing method thereofLIN YA-WEN·Filed 2012·Granted Feb 3, 2015·1 cites·2 claims
- 1367US9449864B2Systems and methods for fabricating and orienting semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·1 cites·19 claims
- 1466US9691641B2Apparatus and method of cleaning wafersHUANG CHIA-HUNG·Filed 2012·Granted Jun 27, 2017·2 cites·18 claims
- 1566US8916400B2Manufacturing method for an LED comprising a nitrided AlN reflecting layerHUANG CHIA-HUNG·Filed 2012·Granted Dec 23, 2014·2 cites·8 claims
- 1666US8843860B2Frame cell for shot layout flexibilityLIN CHIN-MING·Filed 2012·Granted Sep 23, 2014·1 cites·19 claims
- 1765US8871605B2Methods for fabricating and orienting semiconductor wafersLIN CHIN-MING·Filed 2012·Granted Oct 28, 2014·1 cites·19 claims
- 1865US7713912B2Nano photocatalytic sol and application thereofIND TECH RES INST·Filed 2006·Granted May 11, 2010·2 cites·20 claims
- 1963US11942570B2Micro light-emitting diode comprising nanoring and manufacturing method thereofCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 2062US8450749B2Light emitting element and manufacturing method thereofTU PO-MIN·Filed 2011·Granted May 28, 2013·1 cites·10 claims
- 2162US2024175649A1Heat Exchange Tube and Manufacturing Method ThereforMETAL IND RES & DEV CT·Filed 2022·Application pending·0 cites
- 2261US11658270B2Light emitting diode and light purification method thereforCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD·Filed 2021·Granted May 23, 2023·0 cites·16 claims
- 2360US12057521B2Superlattice layer, LED epitaxial structure, display device, and method for manufacturing LED epitaxial structureCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 2460US8987025B2Method for manufacturing light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 24, 2015·0 cites·14 claims
- 2559US8809564B2Platinum complex, manufacturing method thereof and platinum catalyst constructed therebyHWANG WENG-SING·Filed 2010·Granted Aug 19, 2014·1 cites·1 claims
- 2655US8629534B2Semiconductor structure having low thermal stressADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jan 14, 2014·0 cites·11 claims
- 2753US7179110B1Stably fastened safety plugHUANG CHIA-HUNG·Filed 2006·Granted Feb 20, 2007·4 cites·8 claims
- 2852US10109770B2Method for manufacturing light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Oct 23, 2018·0 cites·8 claims
- 2952US2021210664A1Led chip and method for manufacturing the sameCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD·Filed 2021·Application pending·0 cites
- 3052US2021210656A1Method for micro-led epitaxial wafer manufacturing and micro-led epitaxial waferCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD·Filed 2021·Application pending·0 cites
- 3151US10759162B2Printing head moduleXYZPRINTING INC·Filed 2017·Granted Sep 1, 2020·0 cites·12 claims
- 3251US2015265917A1Game apparatusCHANG CHIA-HAN·Filed 2014·Application pending·0 cites
- 3350US8519419B2Semiconductor light-emitting structure having low thermal stressHUANG SHIH-CHENG·Filed 2011·Granted Aug 27, 2013·0 cites·14 claims
- 3450US2022052224A1Light-emitting diode, manufacturing method thereof and displayCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD·Filed 2021·Application pending·0 cites
- 3549US2021242384A1Light-emitting diode chip, display panel, electronic deviceCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD·Filed 2021·Application pending·0 cites
- 3649US2020247025A1Method of molding a product including at least one turning part including at least one of an undercut part and a right-angle part, product manufactured by the method, and molding device manufacturing the product by the methodXRSPACE CO LTD·Filed 2019·Application pending·0 cites
- 3748US9786818B2Light emitting diode and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Oct 10, 2017·0 cites·7 claims
- 3848US9359210B2Method for manufacturing a graphene layerMETAL IND RES & DEV CT·Filed 2013·Granted Jun 7, 2016·0 cites·8 claims
- 3947US10144174B2Three dimensional printing apparatus and printing head moduleXYZPRINTING INC·Filed 2016·Granted Dec 4, 2018·0 cites·20 claims
- 4047US8563340B2Method for manufacturing light emitting chipHUANG SHIH-CHENG·Filed 2011·Granted Oct 22, 2013·0 cites·17 claims
- 4147US8461619B2Light emitting diode chip and method of manufacturing the sameHUANG CHIA-HUNG·Filed 2012·Granted Jun 11, 2013·0 cites·11 claims
- 4247US2012100656A1Method for making a solid state semiconductor deviceHUANG SHIH-CHENG·Filed 2011·Application pending·0 cites
- 4347US2023215972A1Epitaxial Wafer of Red Light-Emitting Diode, and Preparation Method ThereforCHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSITUTE CO LTD·Filed 2020·Application pending·0 cites
- 4447US2009224226A1Light emitting device of group iii nitride based semiconductorADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 4546US2019080890A1Vacuum deposition composite targetMETAL IND RES & DEV CT·Filed 2017·Application pending·0 cites
- 4645US8536597B2Light emitting diode with peripheral circular slots and method for manufacturing the sameTU PO-MIN·Filed 2011·Granted Sep 17, 2013·0 cites·4 claims
- 4745US8394653B2Method for fabricating semiconductor lighting chipTU PO-MIN·Filed 2011·Granted Mar 12, 2013·0 cites·16 claims
- 4844US2012256162A1Light emitting diode and manufacturing method thereofHUANG CHIA-HUNG·Filed 2012·Application pending·0 cites
- 4943US8492304B2Iron complex, manufacturing method thereof and supported iron oxide catalyst constructed therebyHWANG WENG-SING·Filed 2009·Granted Jul 23, 2013·0 cites·8 claims
- 5043US2012074531A1Epitaxy substrateTU PO-MIN·Filed 2011·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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