Inventor · disambiguated record
Hui Mei Jao
Also filed as: JAO HUI MEI
3 granted patents·2 citations·filing 2011–2015
51Inventor score
Top patents by PatentIndex Score
3 records- 0164US8748885B2Soft material wafer bonding and method of bondingYEH TUNG-TI·Filed 2012·Granted Jun 10, 2014·2 cites·20 claims
- 0242US9368387B2Method of forming shallow trench isolation structureTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 14, 2016·0 cites·17 claims
- 0335US8592297B2Wafer and method of processing waferYEH TUNG-TI·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →