Inventor · disambiguated record
Jiou-Kang Lee
Also filed as: LEE JIOU-KANG
37 granted patents·2 pending applications·249 citations·filing 2008–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16TAIWAN SEMICONDUCTOR MFG11WU TING-HAU7CHU CHIA-HUA1LEE JIOU-KANG1
Top patents by PatentIndex Score
39 records- 0198US9238581B2Triple-axis MEMS accelerometerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 19, 2016·50 cites·20 claims
- 0297US9138994B2MEMS devices and methods of fabrication thereofPENG JUNG-HUEI·Filed 2010·Granted Sep 22, 2015·49 cites·20 claims
- 0397US9133017B2MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 15, 2015·49 cites·20 claims
- 0496US8987059B2MEMS devices and methods of forming sameLIANG KAI-CHIH·Filed 2012·Granted Mar 24, 2015·46 cites·20 claims
- 0595US9604840B1MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 28, 2017·9 cites·20 claims
- 0693US11186481B2Sensor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 30, 2021·6 cites·19 claims
- 0787US8455999B2Method for reducing chip warpageWU TING-HAU·Filed 2011·Granted Jun 4, 2013·5 cites·20 claims
- 0884US8232614B1Package systems having a conductive element through a substrate thereof and manufacturing methods of the sameCHU CHIA-HUA·Filed 2011·Granted Jul 31, 2012·6 cites·20 claims
- 0982US8748205B1MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 10, 2014·5 cites·20 claims
- 1080US9617147B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·2 cites·20 claims
- 1179US8053336B2Method for reducing chip warpageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 8, 2011·5 cites·19 claims
- 1277US9006015B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·2 cites·20 claims
- 1375US11104129B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 1474US10266399B2Apparatus and method of manufacturing for combo MEMS device accommodating different working pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 1571US9422151B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·1 cites·20 claims
- 1670US7998775B2Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structuresTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Aug 16, 2011·3 cites·14 claims
- 1769US10688786B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1868US8281658B2Method to produce 3-D optical gyroscope my MEMS technologyWU TING-HAU·Filed 2009·Granted Oct 9, 2012·3 cites·17 claims
- 1967US8237235B2Metal-ceramic multilayer structureWU TING-HAU·Filed 2010·Granted Aug 7, 2012·1 cites·27 claims
- 2066US8362578B2Triple-axis MEMS accelerometerTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·1 cites·19 claims
- 2164US11180365B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 2263US8218286B2MEMS microphone with single polysilicon filmWU TING-HAU·Filed 2008·Granted Jul 10, 2012·2 cites·20 claims
- 2363US7923379B2Multi-step process for forming high-aspect-ratio holes for MEMS devicesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 12, 2011·2 cites·9 claims
- 2462US9950522B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·0 cites·20 claims
- 2561US10457550B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·0 cites·20 claims
- 2660US8367516B2Laser bonding for stacking semiconductor substratesTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Feb 5, 2013·1 cites·24 claims
- 2758US2025374589A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2857US10099919B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 16, 2018·0 cites·21 claims
- 2957US9677884B2Methods of forming a gyroscope sensor and a structure for a gyroscope sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 13, 2017·0 cites·20 claims
- 3054US9499396B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 3154US2025081509A1Gate dielectric features in high-voltage ic devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3253US8776600B2Gyroscope sensorsWU TING-HAU·Filed 2012·Granted Jul 15, 2014·0 cites·20 claims
- 3351US7999257B2Process for eliminating delamination between amorphous silicon layersTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 16, 2011·0 cites·19 claims
- 3450US9725299B1MEMS device and multi-layered structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 8, 2017·0 cites·20 claims
- 3549US8237263B2Method and apparatus for cooling an integrated circuitWU TING-HAU·Filed 2009·Granted Aug 7, 2012·0 cites·22 claims
- 3648US8309441B2Process for eliminating delamination between amorphous silicon layersLEE JIOU-KANG·Filed 2011·Granted Nov 13, 2012·0 cites·13 claims
- 3748US8053377B2Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·0 cites·19 claims
- 3847US8563400B2Laser bonding for stacking semiconductor substratesTAIWAN SEMICONDUCTOR MANFUCATURING COMPANY LTD·Filed 2013·Granted Oct 22, 2013·0 cites·20 claims
- 3939US8106470B2Triple-axis MEMS accelerometer having a bottom capacitorWU TING-HAU·Filed 2010·Granted Jan 31, 2012·0 cites·20 claims
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