Inventor · disambiguated record

Kelvin Tai

Also filed as: TAI KELVIN

1 granted patent·11 citations·filing 2014–2014

36Inventor score

Technology areasH10D

Files withTAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

1 record

0181US8921145B2Hybrid MEMS bump design to prevent in-process and in-use stictionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 30, 2014·11 cites·20 claims

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