Inventor · disambiguated record
Tae Hyuk Kim
Also filed as: KIM TAE HYUK · KIM TAE W
3 granted patents·6 pending applications·23 citations·filing 1996–2024
66Inventor score
Top patents by PatentIndex Score
9 records- 0162US2024147742A1Method for manufacturing high-performance indoor photovoltaic cell using self-assembled monolayers and indoor photovoltaic cell manufactured therebyUNIV KOREA RES & BUS FOUND·Filed 2023·Application pending·0 cites
- 0257US2024224548A1Efficient indoor photovoltaic cell based on two-dimensional mxene nanosheets and manufacturing method thereofUNIV KOREA RES & BUS FOUND·Filed 2023·Application pending·0 cites
- 0357US2025081709A1Wavelength self-filtering ultra-low noise near infrared quantum dot photodiode manufacturing method and near infrared quantum dot photodiode manufactured therebyUNIV KOREA RES & BUS FOUND·Filed 2024·Application pending·0 cites
- 0454US2023422532A1Artificial indoor photovoltaic cell and manufacturing method thereofUNIV KOREA RES & BUS FOUND·Filed 2023·Application pending·0 cites
- 0548US5851853AMethod of attaching a die onto a pad of a lead frameSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Dec 22, 1998·18 cites·15 claims
- 0647US2006138492A1CMOS image sensor and method for fabricating the sameSHIM HEE S·Filed 2005·Application pending·0 cites
- 0745US7631795B2System and method for automated wire bondingSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 15, 2009·3 cites·20 claims
- 0845US6971863B2Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agentSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 6, 2005·2 cites·35 claims
- 0932US2005126696A1Snap cure device for semiconductor chip attachmentFiled 2004·Application pending·0 cites
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