Inventor · disambiguated record
Travis Eiles
Also filed as: EILES TRAVIS · EILES TRAVIS M · EILES TRAVIS MATTHEW
13 granted patents·2 pending applications·252 citations·filing 1997–2023
92Inventor score
Top patents by PatentIndex Score
15 records- 0189US5907464AMOSFET-based power supply clamps for electrostatic discharge protection of integrated circuitsINTEL CORP·Filed 1997·Granted May 25, 1999·81 cites·22 claims
- 0285US6876053B1Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 1999·Granted Apr 5, 2005·61 cites·7 claims
- 0384US9651610B2Visible laser probing for circuit debug and defect analysisEILES TRAVIS M·Filed 2013·Granted May 16, 2017·10 cites·20 claims
- 0483US11499817B2Coordinate measuring machine with vision probe for performing points-from-focus type measurement operationsMITUTOYO CORP·Filed 2020·Granted Nov 15, 2022·3 cites·21 claims
- 0579US6607928B1Integrated circuit device having an embedded heat slugINTEL CORP·Filed 2000·Granted Aug 19, 2003·24 cites·41 claims
- 0678US7410858B2Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 2006·Granted Aug 12, 2008·6 cites·24 claims
- 0773US7660054B2Thermally controlled sold immersion lens fixtureINTEL CORP·Filed 2007·Granted Feb 9, 2010·7 cites·13 claims
- 0873US7411269B2Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 2005·Granted Aug 12, 2008·4 cites·24 claims
- 0973US6570247B1Integrated circuit device having an embedded heat slugINTEL CORP·Filed 1997·Granted May 27, 2003·37 cites·39 claims
- 1070US10163601B1Probe assembly with high bandwidth beamINTEL CORP·Filed 2017·Granted Dec 25, 2018·2 cites·25 claims
- 1168US6882170B2Device speed alteration by electron-hole pair injection and device heatingINTEL CORP·Filed 2002·Granted Apr 19, 2005·13 cites·16 claims
- 1260US12504301B2Inductive linear encoder with gap adjustmentMITUTOYO CORP·Filed 2023·Granted Dec 23, 2025·0 cites·21 claims
- 1349US2007013023A1Isolation structure configurations for modifying stresses in semiconductor devicesMA QING·Filed 2006·Application pending·0 cites
- 1444US6519744B2Semiconductor die manufacture method to limit a voltage drop on a power plane thereof by noninvasively measuring voltages on a power planeINTEL CORP·Filed 2000·Granted Feb 11, 2003·4 cites·21 claims
- 1536US2006249859A1Metrology system and method for stacked wafer alignmentEILES TRAVIS M·Filed 2005·Application pending·0 cites
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