Inventor · disambiguated record
Vijaylaxmi Gumaste
Also filed as: GUMASTE VIJAYLAXMI
2 granted patents·1 pending application·45 citations·filing 2005–2007
63Inventor score
Technology areasH10W
Files withNAT SEMICONDUCTOR CORP3
Top patents by PatentIndex Score
3 records- 0190US7808089B2Leadframe having die attach pad with delamination and crack-arresting featuresNAT SEMICONDUCTOR CORP·Filed 2007·Granted Oct 5, 2010·30 cites·14 claims
- 0282US7385297B1Under-bond pad structures for integrated circuit devicesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Jun 10, 2008·15 cites·19 claims
- 0342US2009152683A1Rounded die configuration for stress minimization and enhanced thermo-mechanical reliabilityNAT SEMICONDUCTOR CORP·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →