Inventor · disambiguated record
Heewoo Park
Also filed as: PARK HEEWOO
2 granted patents·3 citations·filing 2019–2021
42Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0177US11049814B2Semiconductor device including a through contact extending between sub-chips and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·20 claims
- 0257US11658125B2Semiconductor device with a through contact and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →