Inventor · disambiguated record
Kazunari Michii
Also filed as: MICHII KAZUNARI
30 granted patents·2 pending applications·1,341 citations·filing 1989–2006
98Inventor score
Top patents by PatentIndex Score
32 records- 0198US5252853APackaged semiconductor device having tab tape and particular power distribution lead structureMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Oct 12, 1993·402 cites·5 claims
- 0296US6353265B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 5, 2002·144 cites·6 claims
- 0394US6545366B2Multiple chip package semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 8, 2003·114 cites·12 claims
- 0492US6836007B2Semiconductor package including stacked semiconductor chipsRENESAS TECH CORP·Filed 2003·Granted Dec 28, 2004·80 cites·3 claims
- 0592US6445064B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 3, 2002·93 cites·13 claims
- 0689US6670701B2Semiconductor module and electronic componentMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 30, 2003·48 cites·16 claims
- 0786USD475981SIntegrated circuits substrateMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jun 17, 2003·33 cites·1 claims
- 0876US6858938B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Feb 22, 2005·23 cites·6 claims
- 0975US5373188APackaged semiconductor device including multiple semiconductor chips and cross-over leadMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Dec 13, 1994·50 cites·14 claims
- 1075US5105257APackaged semiconductor device and semiconductor device packaging elementMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Apr 14, 1992·54 cites·6 claims
- 1172US5334803ASemiconductor device and method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 2, 1994·40 cites·12 claims
- 1271US5303120AMethod of manufacturing inversion type IC's and IC module using sameMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Apr 12, 1994·39 cites·18 claims
- 1365US6583511B2Semiconductor device and a method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 24, 2003·13 cites·2 claims
- 1465US5053855APlastic molded-type semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Oct 1, 1991·34 cites·12 claims
- 1561US5196917ACarrier tapeMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Mar 23, 1993·26 cites·3 claims
- 1658US6798056B2Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Sep 28, 2004·8 cites·7 claims
- 1758US6518652B2Semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Feb 11, 2003·10 cites·6 claims
- 1857US6552418B2Resin-encapsulated semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 22, 2003·8 cites·28 claims
- 1957US5067005ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Nov 19, 1991·26 cites·10 claims
- 2055US6614101B2Lead frame with raised leads and plastic packaged semiconductor device using the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 2, 2003·8 cites·7 claims
- 2153US5508232AMethod of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Apr 16, 1996·20 cites·16 claims
- 2251US5424577ALead frame for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jun 13, 1995·18 cites·5 claims
- 2350US7166490B2Semiconductor device with terminals, and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jan 23, 2007·4 cites·3 claims
- 2448USRE36077EMethod of manufacturing inversion type IC's and IC module using sameMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 2, 1999·13 cites·13 claims
- 2546US7348191B2Semiconductor device with terminals, and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Mar 25, 2008·0 cites·1 claims
- 2646US6737733B2Sealed semiconductor device and lead frame used for the sameRENESAS TECH CORP·Filed 2001·Granted May 18, 2004·2 cites·10 claims
- 2746US5220196ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 15, 1993·16 cites·8 claims
- 2844US6836004B2Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frameRENESAS TECH CORP·Filed 2003·Granted Dec 28, 2004·2 cites·1 claims
- 2942US6323545B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 27, 2001·10 cites·4 claims
- 3037US2004159925A1Semiconductor device and method for manufacture thereofRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 3136US2003052393A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 3233USRE35496ESemiconductor device and method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Apr 29, 1997·3 cites·12 claims
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