Inventor · disambiguated record
Hideji Aoki
Also filed as: AOKI HIDEJI
13 granted patents·251 citations·filing 1982–2001
93Inventor score
Top patents by PatentIndex Score
13 records- 0186US5587633APress control method and press apparatusMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Dec 24, 1996·46 cites·12 claims
- 0281US4626960ASemiconductor device having soldered bond between base and cap thereofFUJITSU LTD·Filed 1984·Granted Dec 2, 1986·49 cites·11 claims
- 0370US4458291APackage for enclosing semiconductor elementsFUJITSU LTD·Filed 1982·Granted Jul 3, 1984·36 cites·7 claims
- 0464US5520276AMethod and apparatus for carrying and locating sheet frameMITSUBISHI ELECTRIC CORP·Filed 1993·Granted May 28, 1996·27 cites·26 claims
- 0558US6337042B1Press machine and method of manufacturing pressed productsMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 8, 2002·12 cites·8 claims
- 0656US5177992ADevice for feeding thin-web frameMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jan 12, 1993·11 cites·8 claims
- 0755US6530764B2Mold for resin-sealing of semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 11, 2003·9 cites·17 claims
- 0853US6363976B1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 2, 2002·8 cites·12 claims
- 0944US4558346AHighly reliable hermetically sealed package for a semiconductor deviceFUJITSU LTD·Filed 1983·Granted Dec 10, 1985·13 cites·7 claims
- 1043US5636127AMethod and apparatus for carrying and locating sheet frameMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 3, 1997·11 cites·4 claims
- 1138US5842257AApparatus for and method of fabricating semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Dec 1, 1998·9 cites·31 claims
- 1238US4590672APackage for electronic device and method for producing sameFUJITSU LTD·Filed 1982·Granted May 27, 1986·10 cites·9 claims
- 1335US6242287B1Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resinMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jun 5, 2001·10 cites·10 claims
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