Inventor · disambiguated record
Yoshiyuki Mishima
Also filed as: MISHIMA YOSHIYUKI
1 granted patent·1 pending application·9 citations·filing 2001–2002
31Inventor score
Files withMITSUBISHI ELECTRIC CORP2
Top patents by PatentIndex Score
2 records- 0155US6530764B2Mold for resin-sealing of semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 11, 2003·9 cites·17 claims
- 0229US2003180985A1Method for manufacturing a semiconductor device and a resin sealing device thereforMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →