Inventor · disambiguated record
Andrea Cigada
Also filed as: CIGADA ANDREA · CIGADA ANDREA GIOVANNI
8 granted patents·1 pending application·146 citations·filing 1998–2004
86Inventor score
Top patents by PatentIndex Score
9 records- 0187US6087202AProcess for manufacturing semiconductor packages comprising an integrated circuitST MICROELECTRONICS SA·Filed 1998·Granted Jul 11, 2000·114 cites·2 claims
- 0259US6811738B2Manufacturing method of an electronic device packageST MICROELECTRONICS SRL·Filed 2001·Granted Nov 2, 2004·8 cites·8 claims
- 0351US6842300B2Optical device with objective slidable engaged with support structureST MICROELECTRONICS SRL·Filed 2002·Granted Jan 11, 2005·2 cites·27 claims
- 0450US6838755B2Leadframe for integrated circuit chips having low resistance connectionsST MICROELECTRONICS SRL·Filed 2001·Granted Jan 4, 2005·5 cites·16 claims
- 0549US7238014B2Manufacturing method of an electronic device packageST MICROELECTRONICS SRL·Filed 2004·Granted Jul 3, 2007·3 cites·7 claims
- 0649US7075172B2Lead-frame for semiconductor devicesST MICROELECTRONICS SDN·Filed 2001·Granted Jul 11, 2006·8 cites·28 claims
- 0740US2003051738A1Process for cleaning an integrated circuit package surface, for preparing the same for a subsequent ink marking process, and process for manufacturing an integrated circuit using such a cleaning processST MICROELECTRONICS SRL·Filed 2001·Application pending·0 cites
- 0836US6518099B2Plated leadframes with cantilevered leadsST MICROELECTRONICS SRL·Filed 2001·Granted Feb 11, 2003·0 cites·15 claims
- 0935US6323544B1Plated leadframes with cantilevered leadsST MICROELECTRONICS SRL·Filed 1999·Granted Nov 27, 2001·6 cites·17 claims
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