Inventor · disambiguated record
Wade Sonnenberg
Also filed as: SONNENBERG WADE · SONNENBERG WADE W
26 granted patents·9 pending applications·738 citations·filing 1988–2005
97Inventor score
Top patents by PatentIndex Score
35 records- 0196US5252196ACopper electroplating solutions and processesSHIPLEY CO·Filed 1991·Granted Oct 12, 1993·134 cites·46 claims
- 0292US6911068B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Jun 28, 2005·35 cites·23 claims
- 0390US6827839B2Plating bath analysisSHIPLEY CO LLC·Filed 2001·Granted Dec 7, 2004·33 cites·8 claims
- 0490US6773573B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Aug 10, 2004·31 cites·17 claims
- 0590US6736954B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted May 18, 2004·27 cites·31 claims
- 0689US6899829B2Conductive polymer colloidal compositions with selectivity for non-conductive surfacesSHIPLEY CO LLC·Filed 2001·Granted May 31, 2005·24 cites·17 claims
- 0789US5223118AMethod for analyzing organic additives in an electroplating bathSHIPLEY CO·Filed 1991·Granted Jun 29, 1993·94 cites·19 claims
- 0885US5051154AAdditive for acid-copper electroplating baths to increase throwing powerSHIPLEY CO·Filed 1990·Granted Sep 24, 1991·67 cites·60 claims
- 0983US6652731B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Nov 25, 2003·28 cites·15 claims
- 1077US6752878B2Process for treating adhesion promoted metal surfacesSHIPLEY CO LLC·Filed 2001·Granted Jun 22, 2004·23 cites·14 claims
- 1175US6440642B1Dielectric compositionSHIPLEY CO LLC·Filed 1999·Granted Aug 27, 2002·44 cites·15 claims
- 1271US5068013AElectroplating composition and processSHIPLEY CO·Filed 1990·Granted Nov 26, 1991·34 cites·5 claims
- 1369US4932518AMethod and apparatus for determining throwing power of an electroplating solutionSHIPLEY CO·Filed 1989·Granted Jun 12, 1990·25 cites·10 claims
- 1464US5004525ACopper electroplating compositionSHIPLEY CO·Filed 1989·Granted Apr 2, 1991·12 cites·4 claims
- 1563US4897165AElectroplating composition and process for plating through holes in printed circuit boardsSHIPLEY CO·Filed 1988·Granted Jan 30, 1990·21 cites·16 claims
- 1662US7384535B2Bath analysisROHM & HAAS ELECT MAT·Filed 2004·Granted Jun 10, 2008·6 cites·8 claims
- 1761US6174647B1Metallization process and componentSHIPLEY CO LLC·Filed 1998·Granted Jan 16, 2001·20 cites·12 claims
- 1856US2006081475A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 1955US5425873AElectroplating processSHIPLEY CO LLC·Filed 1994·Granted Jun 20, 1995·20 cites·26 claims
- 2054US2005139118A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2004·Application pending·0 cites
- 2150US6123995AMethod of manufacture of multilayer circuit boardsSHIPLEY CO LLC·Filed 1998·Granted Sep 26, 2000·14 cites·5 claims
- 2250US5800739AStabilized dispersions of graphite particlesSHIPLEY CO LLC·Filed 1996·Granted Sep 1, 1998·11 cites·10 claims
- 2350US2004074778A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2449US2005155866A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2547US2005016858A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2643US6039859AMethod for electroplating using stabilized dispersions of conductive particlesSHIPLEY CO LLC·Filed 1998·Granted Mar 21, 2000·7 cites·9 claims
- 2743US5667662AElectroplating process and compositionSHIPLEY CO LLC·Filed 1996·Granted Sep 16, 1997·11 cites·9 claims
- 2843US2006151327A1Analysis methodROHM & HAAS ELECT MAT·Filed 2004·Application pending·0 cites
- 2942US2004104124A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 3041US2003066756A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 3137US5419829AElectroplating processROHM & HAAS·Filed 1994·Granted May 30, 1995·6 cites·22 claims
- 3236US6036835AMethod of microetching a conductive polymer on multilayer circuit boardsSHIPLEY CO LLC·Filed 1997·Granted Mar 14, 2000·5 cites·11 claims
- 3333US5395652APlating catalyst formed from noble metal ions and bromide ionsSHIPLEY CO·Filed 1994·Granted Mar 7, 1995·3 cites·20 claims
- 3430US6017967AElectroplating process and compositionSHIPLEY CO LLC·Filed 1996·Granted Jan 25, 2000·3 cites·6 claims
- 3530US2001006759A1Radiation sensitive compositionsCHARLES R SHIPLEY JR·Filed 1998·Application pending·0 cites
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