Inventor · disambiguated record
David B. Noddin
Also filed as: NODDIN DAVID · NODDIN DAVID B
20 granted patents·1,460 citations·filing 1988–2000
97Inventor score
Top patents by PatentIndex Score
20 records- 0198US6103992AMultiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-viasGORE & ASS·Filed 1996·Granted Aug 15, 2000·172 cites·33 claims
- 0298US6018196ASemiconductor flip chip packageGORE & ASS·Filed 1999·Granted Jan 25, 2000·182 cites·3 claims
- 0397US4915981AMethod of laser drilling fluoropolymer materialsROGERS CORP·Filed 1988·Granted Apr 10, 1990·131 cites·16 claims
- 0494US5046238AMethod of manufacturing a multilayer circuit boardROGERS CORP·Filed 1990·Granted Sep 10, 1991·184 cites·12 claims
- 0591US6203891B1Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-viasGORE & ASS·Filed 2000·Granted Mar 20, 2001·41 cites·12 claims
- 0689US5841102AMultiple pulse space processing to enhance via entrance formation at 355 nmGORE & ASS·Filed 1996·Granted Nov 24, 1998·103 cites·35 claims
- 0784US6132853AMultiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-viasW L GORE & ASSSOCIATES INC·Filed 1999·Granted Oct 17, 2000·48 cites·33 claims
- 0884US6011697AConstraining ring for use in electronic packagingGORE & ASS·Filed 1998·Granted Jan 4, 2000·43 cites·17 claims
- 0984US5731047AMultiple frequency processing to improve electrical resistivity of blind micro-viasGORE & ASS·Filed 1996·Granted Mar 24, 1998·77 cites·30 claims
- 1084US5276955AMultilayer interconnect system for an area array interconnection using solid state diffusionSUPERCOMPUTER SYSTEMS LTD·Filed 1992·Granted Jan 11, 1994·99 cites·29 claims
- 1181US5965043AMethod for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-viasGORE & ASS·Filed 1996·Granted Oct 12, 1999·67 cites·31 claims
- 1280US5973290ALaser apparatus having improved via processing rateGORE & ASS·Filed 1997·Granted Oct 26, 1999·58 cites·27 claims
- 1378US5910255AMethod of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formationGORE & ASS·Filed 1996·Granted Jun 8, 1999·53 cites·16 claims
- 1477US6130015AMethod for using fiducial schemes to increase nominal registration during manufacture of laminated circuitGORE & ASS·Filed 2000·Granted Oct 10, 2000·26 cites·3 claims
- 1576US6184589B1Constraining ring for use in electronic packagingFiled 1998·Granted Feb 6, 2001·39 cites·7 claims
- 1675US6127250AMethod of increasing package reliability by designing in plane CTE gradientsGORE & ASS·Filed 1998·Granted Oct 3, 2000·35 cites·9 claims
- 1768US5868950AMethod to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniquesGORE & ASS·Filed 1996·Granted Feb 9, 1999·35 cites·62 claims
- 1867US5888630AApparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assemblyGORE & ASS·Filed 1996·Granted Mar 30, 1999·26 cites·4 claims
- 1965US6023041AMethod for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter varianceGORE & ASS·Filed 1996·Granted Feb 8, 2000·30 cites·32 claims
- 2049US5879786AConstraining ring for use in electronic packagingGORE & ASS·Filed 1996·Granted Mar 9, 1999·11 cites·6 claims
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