Inventor · disambiguated record
Po-Kai Hou
Also filed as: HOU PO KAI
2 granted patents·5 pending applications·13 citations·filing 2008–2009
50Inventor score
Technology areasH10W
Files withCHIPMOS TECHNOLOGIES INC7
Top patents by PatentIndex Score
7 records- 0177US7812432B2Chip package with a dam structure on a die padCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Oct 12, 2010·13 cites·13 claims
- 0245US7842550B2Method of fabricating quad flat non-leaded packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Nov 30, 2010·0 cites·17 claims
- 0342US2009321988A1Chip packaging processCHIPMOS TECHNOLOGIES INC·Filed 2009·Application pending·0 cites
- 0441US2009127684A1Leadframe for leadless packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 0541US2009108419A1Leadframe for leadless packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 0641US2009206519A1Chip packaging apparatus and chip packaging processCHIPMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 0741US2009108424A1Leadframe for leadless packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →