Inventor · disambiguated record
Kia-Seng Low
Also filed as: LOW KIA S · LOW KIA-SENG
15 granted patents·2 pending applications·357 citations·filing 2001–2012
94Inventor score
Top patents by PatentIndex Score
17 records- 0194US6570256B2Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substratesIBM·Filed 2001·Granted May 27, 2003·85 cites·11 claims
- 0289US6743642B2Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technologyIBM·Filed 2002·Granted Jun 1, 2004·37 cites·10 claims
- 0388US6985384B2Spacer integration scheme in MRAM technologyIBM·Filed 2002·Granted Jan 10, 2006·41 cites·10 claims
- 0488US6740539B2Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substratesIBM·Filed 2003·Granted May 25, 2004·37 cites·11 claims
- 0583US7097777B2Magnetic switching deviceIBM·Filed 2005·Granted Aug 29, 2006·9 cites·16 claims
- 0683US6858441B2MRAM MTJ stack to conductive line alignment methodINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 22, 2005·37 cites·27 claims
- 0779US6884630B2Two-step magnetic tunnel junction stack depositionIBM·Filed 2003·Granted Apr 26, 2005·18 cites·49 claims
- 0878US6768150B1Magnetic memoryINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 27, 2004·26 cites·15 claims
- 0975US7087438B2Encapsulation of conductive lines of semiconductor devicesIBM·Filed 2004·Granted Aug 8, 2006·18 cites·22 claims
- 1073US6846683B2Method of forming surface-smoothing layer for semiconductor devices with magnetic material layersINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 25, 2005·14 cites·8 claims
- 1171US6680500B1Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layersINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 20, 2004·18 cites·11 claims
- 1262US6974770B2Self-aligned mask to reduce cell layout areaIBM·Filed 2003·Granted Dec 13, 2005·10 cites·19 claims
- 1360US7125790B2Inclusion of low-k dielectric material between bit linesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 24, 2006·7 cites·23 claims
- 1453US8299622B2IC having viabar interconnection and related methodCHIDAMBARRAO DURESETI·Filed 2008·Granted Oct 30, 2012·0 cites·17 claims
- 1550US8492268B2IC having viabar interconnection and related methodCHIDAMBARRAO DURESETI·Filed 2012·Granted Jul 23, 2013·0 cites·6 claims
- 1642US2004084400A1Patterning metal stack layers of magnetic switching device, utilizing a bilayer metal hardmaskFiled 2002·Application pending·0 cites
- 1736US2002098705A1Single step chemical mechanical polish process to improve the surface roughness in MRAM technologyINFINEON TECHNOLOGIES CORP·Filed 2002·Application pending·0 cites
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