Inventor · disambiguated record
Wei Han Koo
Also filed as: KOO WEI HAN
5 granted patents·11 citations·filing 2017–2019
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0182US11075185B2Semiconductor package with multi-level conductive clip for top side coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 27, 2021·4 cites·16 claims
- 0281US11081455B2Semiconductor device with bond pad extensions formed on molded appendageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 3, 2021·4 cites·14 claims
- 0366US10727151B2Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 28, 2020·2 cites·13 claims
- 0464US10396018B2Multi-phase half bridge driver package and methods of manufactureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·1 cites·13 claims
- 0540US10978380B2Semiconductor package with multi-level conductive clip for top side coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →