Inventor · disambiguated record
Tae-Duk Nam
Also filed as: NAM TAE-DUK
3 granted patents·4 pending applications·34 citations·filing 2004–2014
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0191US8674494B2Semiconductor package having supporting plate and method of forming the sameNAM TAE-DUK·Filed 2012·Granted Mar 18, 2014·18 cites·19 claims
- 0290US9412720B2Semiconductor package having supporting plate and method of forming the sameNAM TAE-DUK·Filed 2014·Granted Aug 9, 2016·16 cites·16 claims
- 0342US2006255471A1Flip chip package having protective cap and method of fabricating the sameLEE YONG-KWAN·Filed 2006·Application pending·0 cites
- 0442US2009051023A1Stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0540US7414303B2Lead on chip semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 19, 2008·0 cites·19 claims
- 0639US2007138605A1Adhesive sheet, semiconductor device having the same, multi-stacked package having the same, and methods of manufacturing a semiconductor device and a multi-stacked packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0736US2004245653A1Flip chip package having protective cap and method of fabricating the sameFiled 2004·Application pending·0 cites
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