Inventor · disambiguated record
Hideto Furuyama
Also filed as: FURUYAMA HIDETO
161 granted patents·54 pending applications·1,855 citations·filing 1985–2022
99Inventor score
Top patents by PatentIndex Score
215 records- 0198US6741781B2Optical interconnection circuit board and manufacturing method thereofTOSHIBA KK·Filed 2001·Granted May 25, 2004·131 cites·6 claims
- 0297US9172021B2Semiconductor light emitting deviceTOSHIBA KK·Filed 2015·Granted Oct 27, 2015·23 cites·14 claims
- 0396US7489514B2LSI package equipped with interface module, interface module and connection holding mechanismTOSHIBA KK·Filed 2005·Granted Feb 10, 2009·53 cites·13 claims
- 0495US5412748AOptical semiconductor moduleTOSHIBA KK·Filed 1993·Granted May 2, 1995·158 cites·6 claims
- 0593US10566219B2Chip transfer member, chip transfer apparatus, and chip transfer methodTOSHIBA ELECTRONIC DEVICES & STORAGE CORP·Filed 2018·Granted Feb 18, 2020·8 cites·12 claims
- 0693US8328433B2Optical/electrical composite cableFURUYAMA HIDETO·Filed 2009·Granted Dec 11, 2012·34 cites·20 claims
- 0793US8044483B2Photo detector and optically interconnected LSITOSHIBA KK·Filed 2010·Granted Oct 25, 2011·8 cites·7 claims
- 0893US7352935B2Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection systemTOSHIBA KK·Filed 2005·Granted Apr 1, 2008·28 cites·4 claims
- 0992US9543484B1Semiconductor light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2016·Granted Jan 10, 2017·12 cites·20 claims
- 1091US9341776B2Optical interconnection device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted May 17, 2016·8 cites·23 claims
- 1191US7535090B2LSI package provided with interface moduleKABUHSIKI KAISHA TOSHIBA·Filed 2004·Granted May 19, 2009·59 cites·20 claims
- 1291US6449296B1Semiconductor laser deviceTOSHIBA KK·Filed 2000·Granted Sep 10, 2002·37 cites·25 claims
- 1390US7656928B2Laser-induced optical wiring apparatusTOSHIBA KK·Filed 2007·Granted Feb 2, 2010·11 cites·15 claims
- 1490US7411282B2LSI package provided with interface module, and transmission line header employed in the packageTOSHIBA KK·Filed 2005·Granted Aug 12, 2008·10 cites·20 claims
- 1590US7394665B2LSI package provided with interface module and method of mounting the sameTOSHIBA KK·Filed 2004·Granted Jul 1, 2008·60 cites·19 claims
- 1690US6516104B1Optical wiring deviceTOSHIBA KK·Filed 2000·Granted Feb 4, 2003·54 cites·26 claims
- 1789US9029893B2Semiconductor light emitting device and method for manufacturing the sameTOSHIBA KK·Filed 2013·Granted May 12, 2015·6 cites·22 claims
- 1889US9006764B2Semiconductor light emitting device and light emitting deviceTOSHIBA KK·Filed 2013·Granted Apr 14, 2015·11 cites·20 claims
- 1989US7667982B2LSI package with interface module and interface moduleTOSHIBA KK·Filed 2008·Granted Feb 23, 2010·18 cites·19 claims
- 2089US7314317B2Optical fiber connector and connecting methodTOSHIBA KK·Filed 2005·Granted Jan 1, 2008·19 cites·20 claims
- 2189US5434426AOptical interconnection deviceTOSHIBA KK·Filed 1993·Granted Jul 18, 1995·70 cites·20 claims
- 2288US9172016B2Semiconductor light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Oct 27, 2015·6 cites·19 claims
- 2387US10707378B2Semiconductor light-emitting deviceALPAD CORP·Filed 2017·Granted Jul 7, 2020·2 cites·20 claims
- 2487US8872210B2Semiconductor light emitting deviceFURUYAMA HIDETO·Filed 2012·Granted Oct 28, 2014·8 cites·17 claims
- 2587USRE41742EOptoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection systemTOSHIBA KK·Filed 2009·Granted Sep 21, 2010·13 cites·18 claims
- 2687US7623743B2Optoelectronic interconnection board, optoelectronic interconnection apparatus, and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Nov 24, 2009·14 cites·20 claims
- 2787US6968109B2Optical interconnection circuit board and manufacturing method thereofTOSHIBA KK·Filed 2004·Granted Nov 22, 2005·27 cites·12 claims
- 2886US8957402B2Semiconductor light emitting device and manufacturing method of the sameKOJIMA AKIHIRO·Filed 2012·Granted Feb 17, 2015·4 cites·9 claims
- 2985US9722143B2Semiconductor light-emitting deviceTOSHIBA KK·Filed 2015·Granted Aug 1, 2017·4 cites·20 claims
- 3085US8965149B2Optoelectronic integrated package module and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Feb 24, 2015·7 cites·19 claims
- 3184US10170352B2Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor deviceALPAD CORP·Filed 2015·Granted Jan 1, 2019·4 cites·17 claims
- 3284US7768689B2Photo detector and optically interconnected LSITOSHIBA KK·Filed 2006·Granted Aug 3, 2010·6 cites·6 claims
- 3384US7667311B2LSI package provided with interface module, and transmission line header employed in the packageTOSHIBA KK·Filed 2008·Granted Feb 23, 2010·10 cites·22 claims
- 3484US5205032AElectronic parts mounting apparatusTOSHIBA KK·Filed 1991·Granted Apr 27, 1993·92 cites·18 claims
- 3583US7118294B2Optical semiconductor module and its manufacturing methodTOSHIBA KK·Filed 2004·Granted Oct 10, 2006·23 cites·4 claims
- 3682US9202992B2Semiconductor light emitting device having a fluorescent substance layerTOSHIBA KK·Filed 2014·Granted Dec 1, 2015·3 cites·20 claims
- 3782US9041033B2Semiconductor light emitting deviceTOSHIBA KK·Filed 2013·Granted May 26, 2015·5 cites·20 claims
- 3882US5559918AOptical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layerTOSHIBA KK·Filed 1995·Granted Sep 24, 1996·55 cites·16 claims
- 3981US10541234B2Optical semiconductor module and method of manufacturing the sameTOSHIBA KK·Filed 2017·Granted Jan 21, 2020·3 cites·18 claims
- 4081US7556441B2Optical connector and process for connecting optical fibersTOSHIBA KK·Filed 2007·Granted Jul 7, 2009·10 cites·16 claims
- 4181US7312520B2Interface module for connecting LSI packages, and LSI-incorporating apparatusTOSHIBA KK·Filed 2005·Granted Dec 25, 2007·10 cites·22 claims
- 4281US7198412B2Holder of optical transmission lines and multi-core optical wave-guideTOSHIBA KK·Filed 2004·Granted Apr 3, 2007·22 cites·20 claims
- 4381US7079741B2Optical interconnection circuit board and manufacturing method thereofTOSHIBA KK·Filed 2005·Granted Jul 18, 2006·5 cites·10 claims
- 4481US5719979AOptical semiconductor module and method for manufacturing the sameTOSHIBA KK·Filed 1995·Granted Feb 17, 1998·65 cites·15 claims
- 4580US9755127B2Semiconductor light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2016·Granted Sep 5, 2017·4 cites·16 claims
- 4680US8017956B2Semiconductor light emitting deviceTOSHIBA KK·Filed 2009·Granted Sep 13, 2011·7 cites·20 claims
- 4780US7697799B2Light receiving device and optically interconnected LSITOSHIBA KK·Filed 2008·Granted Apr 13, 2010·5 cites·20 claims
- 4880US7441964B2Optical guide holding member and optical moduleTOSHIBA KK·Filed 2006·Granted Oct 28, 2008·9 cites·17 claims
- 4979US9559279B1Semiconductor light emitting deviceTOSHIBA KK·Filed 2016·Granted Jan 31, 2017·3 cites·20 claims
- 5079US9178118B2Semiconductor light emitting device and method for manufacturing the sameTOSHIBA KK·Filed 2014·Granted Nov 3, 2015·2 cites·10 claims
Showing the top 50 of 215 patent records by PatentIndex Score.
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