Inventor · disambiguated record
Tsang-Yu Liu
Also filed as: LIU TSANG-YU
106 granted patents·34 pending applications·301 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
140 records- 0196US10109559B2Electronic device package and fabrication method thereofXINTEC INC·Filed 2014·Granted Oct 23, 2018·29 cites·19 claims
- 0296US8741683B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jun 3, 2014·24 cites·12 claims
- 0395US8692382B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 8, 2014·23 cites·25 claims
- 0494US8525345B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Sep 3, 2013·21 cites·18 claims
- 0592US8399963B2Chip package and fabrication method thereofTSAI CHIA-LUN·Filed 2010·Granted Mar 19, 2013·14 cites·13 claims
- 0690US8963312B2Stacked chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 24, 2015·11 cites·23 claims
- 0788US8021992B2High aspect ratio gap fill application using high density plasma chemical vapor depositionTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 20, 2011·21 cites·18 claims
- 0887US8803326B2Chip packageXINTEC INC·Filed 2012·Granted Aug 12, 2014·7 cites·22 claims
- 0987US8575634B2Chip package and method for fabricating the sameLIU TSANG-YU·Filed 2010·Granted Nov 5, 2013·9 cites·21 claims
- 1087US8409925B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2011·Granted Apr 2, 2013·8 cites·18 claims
- 1185US9633935B2Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the sameXINTEC INC·Filed 2015·Granted Apr 25, 2017·5 cites·24 claims
- 1285US8673686B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2012·Granted Mar 18, 2014·7 cites·14 claims
- 1384US9355975B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 1481US10050006B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Aug 14, 2018·3 cites·10 claims
- 1581US8890268B2Chip package and fabrication method thereofHUANG YU-LUNG·Filed 2011·Granted Nov 18, 2014·5 cites·16 claims
- 1679US12473197B2Chip packageXINTEC INC·Filed 2023·Granted Nov 18, 2025·0 cites·19 claims
- 1779US11942563B1Manufacturing method of chip package and chip packageXINTEC INC·Filed 2023·Granted Mar 26, 2024·0 cites·10 claims
- 1879US8207615B2Chip package and method for fabricating the sameLOU BAI-YAO·Filed 2011·Granted Jun 26, 2012·6 cites·20 claims
- 1978US9177905B2Chip package having sensing element and method for forming the sameXINTEC INC·Filed 2013·Granted Nov 3, 2015·4 cites·20 claims
- 2077US11137559B2Optical chip package and method for forming the sameXINTEC INC·Filed 2020·Granted Oct 5, 2021·1 cites·29 claims
- 2177US9881889B2Chip package and method for fabricating the sameXINTEC INC·Filed 2014·Granted Jan 30, 2018·4 cites·18 claims
- 2277US9559001B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Jan 31, 2017·5 cites·21 claims
- 2377US8698316B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 15, 2014·3 cites·26 claims
- 2476US8581386B2Chip packageYEN YU-LIN·Filed 2012·Granted Nov 12, 2013·4 cites·20 claims
- 2575US8742564B2Chip package and method for forming the sameLOU BAI-YAO·Filed 2012·Granted Jun 3, 2014·4 cites·18 claims
- 2674US10152180B2Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Dec 11, 2018·2 cites·28 claims
- 2774US9997473B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Jun 12, 2018·2 cites·23 claims
- 2874US9711425B2Sensing module and method for forming the sameXINTEC INC·Filed 2016·Granted Jul 18, 2017·2 cites·22 claims
- 2974US9136241B2Chip package and manufacturing method thereofYEN YU-LIN·Filed 2012·Granted Sep 15, 2015·4 cites·24 claims
- 3074US8975755B2Chip packageXINTEC INC·Filed 2014·Granted Mar 10, 2015·3 cites·20 claims
- 3173US9653422B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted May 16, 2017·2 cites·19 claims
- 3273US9611143B2Method for forming chip packageXINTEC INC·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 3373US9349710B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 24, 2016·2 cites·20 claims
- 3473US9287417B2Semiconductor chip package and method for manufacturing thereofXINTEC INC·Filed 2014·Granted Mar 15, 2016·3 cites·18 claims
- 3573US9184092B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Nov 10, 2015·2 cites·32 claims
- 3673US8779558B2Chip package structure and manufacturing method thereofXINTEC INC·Filed 2013·Granted Jul 15, 2014·2 cites·15 claims
- 3773US8552565B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Oct 8, 2013·3 cites·17 claims
- 3872US9887229B2Sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Feb 6, 2018·2 cites·4 claims
- 3971US11705368B2Manufacturing method of chip package and chip packageXINTEC INC·Filed 2021·Granted Jul 18, 2023·0 cites·4 claims
- 4071US9601460B2Chip package including recess in side edgeXINTEC INC·Filed 2015·Granted Mar 21, 2017·2 cites·21 claims
- 4171US8900924B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Dec 2, 2014·2 cites·30 claims
- 4270US9331256B2Semiconductor structure with sensor chip and landing padsXINTEC INC·Filed 2014·Granted May 3, 2016·2 cites·13 claims
- 4370US9293394B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Mar 22, 2016·2 cites·28 claims
- 4470US8951836B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 10, 2015·2 cites·20 claims
- 4570US8633091B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jan 21, 2014·2 cites·14 claims
- 4670US8536671B2Chip packageLIU TSANG-YU·Filed 2011·Granted Sep 17, 2013·3 cites·28 claims
- 4769US9331024B2IC wafer having electromagnetic shielding effects and method for making the sameXINTEC INC·Filed 2013·Granted May 3, 2016·2 cites·20 claims
- 4869US9153707B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 6, 2015·0 cites·20 claims
- 4968US9437478B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 6, 2016·2 cites·27 claims
- 5068US9425134B2Chip packageXINTEC INC·Filed 2014·Granted Aug 23, 2016·2 cites·21 claims
Showing the top 50 of 140 patent records by PatentIndex Score.
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