Inventor · disambiguated record
Shu-Ming Chang
Also filed as: CHANG SHU-MING
105 granted patents·27 pending applications·449 citations·filing 1994–2024
99Inventor score
Top patents by PatentIndex Score
132 records- 0197US11521938B2Chip package including substrate inclined sidewall and redistribution lineXINTEC INC·Filed 2021·Granted Dec 6, 2022·3 cites·13 claims
- 0295US12341109B2Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Granted Jun 24, 2025·1 cites·18 claims
- 0395US8227927B2Chip package and fabrication method thereofCHEN WEI-MING·Filed 2010·Granted Jul 24, 2012·28 cites·26 claims
- 0494US7663231B2Image sensor module with a three-dimensional die-stacking structureIND TECH RES INST·Filed 2008·Granted Feb 16, 2010·52 cites·9 claims
- 0593US8367477B2Electronic device package and method for forming the sameCHIEN WEN-CHENG·Filed 2010·Granted Feb 5, 2013·16 cites·8 claims
- 0692US7541217B1Stacked chip structure and fabrication method thereofIND TECH RES INST·Filed 2008·Granted Jun 2, 2009·24 cites·13 claims
- 0791US8536672B2Image sensor package and fabrication method thereofCHANG SHU-MING·Filed 2011·Granted Sep 17, 2013·17 cites·21 claims
- 0890US11212912B1Printed circuit board mesh routing to reduce solder ball joint failure during reflowMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2020·Granted Dec 28, 2021·3 cites·20 claims
- 0990US8963312B2Stacked chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 24, 2015·11 cites·23 claims
- 1089US8552547B2Electronic device package and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 8, 2013·7 cites·7 claims
- 1188US8193632B2Three-dimensional conducting structure and method of fabricating the sameCHANG HSIANG-HUNG·Filed 2009·Granted Jun 5, 2012·34 cites·16 claims
- 1288US7772679B2Magnetic shielding package structure of a magnetic memory deviceIND TECH RES INST·Filed 2008·Granted Aug 10, 2010·16 cites·33 claims
- 1387US8710680B2Electronic device package and fabrication method thereofCHANG SHU-MING·Filed 2011·Granted Apr 29, 2014·8 cites·13 claims
- 1487US8409925B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2011·Granted Apr 2, 2013·8 cites·18 claims
- 1586US11784134B2Chip package and manufacturing method thereofXINTEC INC·Filed 2021·Granted Oct 10, 2023·1 cites·9 claims
- 1686US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 1786US7902674B2Three-dimensional die-stacking package structureIND TECH RES INST·Filed 2008·Granted Mar 8, 2011·15 cites·20 claims
- 1885US8673686B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2012·Granted Mar 18, 2014·7 cites·14 claims
- 1985US7988808B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2008·Granted Aug 2, 2011·11 cites·6 claims
- 2084US10446504B2Chip package and method for forming the sameXINTEC INC·Filed 2018·Granted Oct 15, 2019·5 cites·20 claims
- 2184US9355975B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 2283US8772932B2Electronic device packageXINTEC INC·Filed 2012·Granted Jul 8, 2014·4 cites·5 claims
- 2381US7960773B2Capacitor device and method for manufacturing the sameIND TECH RES INST·Filed 2009·Granted Jun 14, 2011·11 cites·7 claims
- 2480US11749618B2Chip package including substrate having through hole and redistribution lineXINTEC INC·Filed 2022·Granted Sep 5, 2023·0 cites·14 claims
- 2580US8860217B1Electronic device packageXINTEC INC·Filed 2014·Granted Oct 14, 2014·3 cites·9 claims
- 2680US7498751B2High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlightHIMAX TECH LTD·Filed 2006·Granted Mar 3, 2009·7 cites·19 claims
- 2779US7319050B2Wafer level chip scale packaging structure and method of fabricating the sameIND TECH RES INST·Filed 2005·Granted Jan 15, 2008·8 cites·6 claims
- 2878US8633582B2Chip package and fabrication method thereofCHANG SHU-MING·Filed 2010·Granted Jan 21, 2014·6 cites·27 claims
- 2977US9881889B2Chip package and method for fabricating the sameXINTEC INC·Filed 2014·Granted Jan 30, 2018·4 cites·18 claims
- 3077US8034025B1Disposable safety syringeCHANG SHU-MING·Filed 2010·Granted Oct 11, 2011·9 cites·6 claims
- 3175US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 3274US10152180B2Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Dec 11, 2018·2 cites·28 claims
- 3374US9711425B2Sensing module and method for forming the sameXINTEC INC·Filed 2016·Granted Jul 18, 2017·2 cites·22 claims
- 3473US9287417B2Semiconductor chip package and method for manufacturing thereofXINTEC INC·Filed 2014·Granted Mar 15, 2016·3 cites·18 claims
- 3573US8779558B2Chip package structure and manufacturing method thereofXINTEC INC·Filed 2013·Granted Jul 15, 2014·2 cites·15 claims
- 3672US8310050B2Electronic device package and fabrication method thereofCHEN WEI-MING·Filed 2011·Granted Nov 13, 2012·2 cites·10 claims
- 3771US9601460B2Chip package including recess in side edgeXINTEC INC·Filed 2015·Granted Mar 21, 2017·2 cites·21 claims
- 3871US8900924B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Dec 2, 2014·2 cites·30 claims
- 3971US7564191B2Inverter having single switching deviceHIMAX TECH LTD·Filed 2006·Granted Jul 21, 2009·4 cites·4 claims
- 4070US8164587B2LCD power supplyCHANG SHU-MING·Filed 2007·Granted Apr 24, 2012·3 cites·32 claims
- 4170US6998718B2Wafer level chip scale packaging structure and method of fabricating the sameIND TECH RES INST·Filed 2004·Granted Feb 14, 2006·15 cites·12 claims
- 4270US5417105AFlow accelerator for leak detector probeHUGHES AIRCRAFT CO·Filed 1994·Granted May 23, 1995·38 cites·15 claims
- 4369US9331024B2IC wafer having electromagnetic shielding effects and method for making the sameXINTEC INC·Filed 2013·Granted May 3, 2016·2 cites·20 claims
- 4469US8610271B2Chip package and manufacturing method thereofPERNG BAW-CHING·Filed 2010·Granted Dec 17, 2013·2 cites·13 claims
- 4569US8564133B2Chip package and method for forming the sameWEN YING-NAN·Filed 2010·Granted Oct 22, 2013·3 cites·22 claims
- 4669US7759877B2Driving system for electronic device and current balancing circuit thereofHIMAX TECH LTD·Filed 2007·Granted Jul 20, 2010·4 cites·14 claims
- 4768US9437478B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 6, 2016·2 cites·27 claims
- 4868US9425134B2Chip packageXINTEC INC·Filed 2014·Granted Aug 23, 2016·2 cites·21 claims
- 4968US9334158B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted May 10, 2016·2 cites·20 claims
- 5067US12376226B2Printed circuit board mesh routing to reduce solder ball joint failure during reflowMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Jul 29, 2025·0 cites·21 claims
Showing the top 50 of 132 patent records by PatentIndex Score.
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