Inventor · disambiguated record

Boyi Wu

Also filed as: WU BOYI

1 granted patent·2 pending applications·2 citations·filing 2010–2025

19Inventor score

Technology areasA47C F16B G01N

Files withWU BOYI2 XIE DONGJI1

Top patents by PatentIndex Score

3 records

0159US8534136B2Pin soldering for printed circuit board failure testingXIE DONGJI·Filed 2010·Granted Sep 17, 2013·2 cites·22 claims
0245US2025221541A1Bed frame structureWU BOYI·Filed 2025·Application pending·0 cites
0341US2025185803A1Frame structureWU BOYI·Filed 2025·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →

Boyi Wu — Patent Inventor | PatentIndex