Inventor · disambiguated record
Keishin Yamazaki
Also filed as: YAMAZAKI KEISHIN
13 granted patents·5 pending applications·149 citations·filing 2005–2025
90Inventor score
Technology areasH10P
Top patents by PatentIndex Score
18 records- 0187USD725055SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Mar 24, 2015·36 cites·1 claims
- 0286USD739832SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 29, 2015·34 cites·1 claims
- 0385US9816182B2Substrate processing apparatus, method for manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 14, 2017·6 cites·10 claims
- 0484USD711843SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Aug 26, 2014·30 cites·1 claims
- 0582US7820118B2Substrate processing apparatus having covered thermocouple for enhanced temperature controlHITACHI INT ELECTRIC INC·Filed 2006·Granted Oct 26, 2010·8 cites·11 claims
- 0675USD719114SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 9, 2014·19 cites·1 claims
- 0775US2025351460A1Substrate processing apparatus, substrate holding apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0869US10351951B2Substrate treatment apparatus including reaction tube with opened lower end, furnace opening member, and flange configured to cover upper surface of the furnace opening memberHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 16, 2019·1 cites·14 claims
- 0967USD720707SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Jan 6, 2015·14 cites·1 claims
- 1066US12387969B2Substrate processing apparatus, substrate holding apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 12, 2025·0 cites·13 claims
- 1155US11377730B2Substrate processing apparatus and furnace opening coverKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jul 5, 2022·0 cites·7 claims
- 1254US8734148B2Heat treatment apparatus and method of manufacturing semiconductor deviceYAMAZAKI KEISHIN·Filed 2011·Granted May 27, 2014·1 cites·6 claims
- 1354US2023189407A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1446US2017088948A1Substrate processing apparatus and furnace opening coverHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 1543US7901206B2Heat-treating apparatus and method of producing substratesHITACHI INT ELECTRIC INC·Filed 2006·Granted Mar 8, 2011·0 cites·14 claims
- 1639US2007275570A1Heat Treatment ApparatusHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
- 1734US8963051B2Heat treatment apparatus and method of manufacturing substratesSHIMADA TOMOHARU·Filed 2005·Granted Feb 24, 2015·0 cites·13 claims
- 1829US2016076149A1Substrate processing apparatus, method of manufacturing semiconductor device and furnace lidHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →