Inventor · disambiguated record
Eric Chih-Fang Liu
Also filed as: LIU ERIC · LIU ERIC C · LIU ERIC CHIH-FANG
45 granted patents·29 pending applications·538 citations·filing 1990–2025
97Inventor score
Files withTOKYO ELECTRON LTD46PAWS FORWARD INC5TAIWAN SEMICONDUCTOR MFG4TITAN PHOTONICS INC4TAIWAN SEMICONDUCTOR MFG CO LTD2
Top patents by PatentIndex Score
74 records- 0195US6233150B1Memory module assemblyFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted May 15, 2001·126 cites·6 claims
- 0295US5348570AAxle housing breatherROCKWELL INTERNATIONAL CORP·Filed 1993·Granted Sep 20, 1994·74 cites·1 claims
- 0393US9704974B2Process of manufacturing Fin-FET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·11 cites·20 claims
- 0493US8900937B2FinFET device structure and methods of making sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·15 cites·22 claims
- 0591US12310338B2Automatic animal feeding system for food pod authenticationPAWS FORWARD INC·Filed 2023·Granted May 27, 2025·2 cites·20 claims
- 0691US5113094AMethod and apparatus for increasing the high frequency sensitivity response of a sampler frequency converterWILTRON CO·Filed 1990·Granted May 12, 1992·125 cites·14 claims
- 0789US11651965B2Method and system for capping of cores for self-aligned multiple patterningTOKYO ELECTRON LTD·Filed 2020·Granted May 16, 2023·2 cites·20 claims
- 0888US6445361B2Dish antenna rotation apparatusACER NEWEB CORP·Filed 2000·Granted Sep 3, 2002·75 cites·26 claims
- 0987US12100598B2Methods for planarizing a substrate using a combined wet etch and chemical mechanical polishing (CMP) processTOKYO ELECTRON LTD·Filed 2022·Granted Sep 24, 2024·1 cites·21 claims
- 1086US9263551B2Simultaneous formation of source/drain openings with different profilesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·9 cites·20 claims
- 1184US9034706B2FinFETs with regrown source/drain and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·8 cites·20 claims
- 1284US2025331495A1Automatic animal feeding system for rotating disposal compartment componentsPAWS FORWARD INC·Filed 2025·Application pending·0 cites
- 1383US6122169AHeat sink assemblyFOXCONN PRECISION COMPONENTS C·Filed 1999·Granted Sep 19, 2000·75 cites·20 claims
- 1482US11121027B2High aspect ratio via etch using atomic layer deposition protection layerTOKYO ELECTRON LTD·Filed 2018·Granted Sep 14, 2021·4 cites·19 claims
- 1580US12471566B2Automatic animal feeding system for presenting and securing food podsPAWS FORWARD INC·Filed 2023·Granted Nov 18, 2025·0 cites·11 claims
- 1680US12446544B2Automatic animal feeding system for self disposing of used food podsPAWS FORWARD INC·Filed 2023·Granted Oct 21, 2025·0 cites·11 claims
- 1780US12376562B2Automatic animal feeding system for rotating disposal compartment componentsPAWS FORWARD INC·Filed 2023·Granted Aug 5, 2025·0 cites·15 claims
- 1880US11424123B2Forming a semiconductor feature using atomic layer etchTOKYO ELECTRON LTD·Filed 2020·Granted Aug 23, 2022·1 cites·20 claims
- 1977US2025244663A1Method for reducing lithography defects and pattern transferTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2075US12265326B2Method for reducing lithography defects and pattern transferTOKYO ELECTRON LTD·Filed 2022·Granted Apr 1, 2025·0 cites·12 claims
- 2166US12506005B2Methods and structures for increasing stability of soft or organic featuresTOKYO ELECTRON LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 2265US10049892B2Method for processing photoresist materials and structuresTOKYO ELECTRON LTD·Filed 2016·Granted Aug 14, 2018·1 cites·16 claims
- 2360US2025298307A1Method for patterning mask layer using metal-containing resistTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2459US12341009B2Variable hardness amorphous carbon maskTOKYO ELECTRON LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 2559US12148624B2Wet etch process and method to control fin height and channel area in a fin field effect transistor (FinFET)TOKYO ELECTRON LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 2659US11333968B2Method for reducing lithography defects and pattern transferTOKYO ELECTRON LTD·Filed 2018·Granted May 17, 2022·0 cites·14 claims
- 2759US2025389142A1Automatic deadbolt assemblies and door lock systemsSECURITECH GROUP INC·Filed 2025·Application pending·0 cites
- 2859US2025308896A1Multiple patterning utilizing a two-color spacer designTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2958US9379220B2FinFET device structure and methods of making sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·0 cites·20 claims
- 3058US2025149335A1Method to pattern a semiconductor substrate using a multilayer photoresist film stackTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3158US2025234606A1Complementary field-effect transistors and methods for forming the sameTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3257US2025306463A1Patterning a substrate using a multi-patterning techniqueTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3357US2025293037A1Method for processing a substrateTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3456US7304773B2Locking apparatus for a movable carry moduleLITE ON TECHNOLOGY CORP·Filed 2004·Granted Dec 4, 2007·2 cites·5 claims
- 3556US2025098277A1Systems and methods for manufacturing semiconductor devicesTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3656US2025013153A1Method of preventing pattern collapseTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3755US12482702B2Wet etch process and methods to form air gaps between metal interconnectsTOKYO ELECTRON LTD·Filed 2022·Granted Nov 25, 2025·0 cites·24 claims
- 3855US12451354B2Double patterning method of patterning a substrateTOKYO ELECTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·16 claims
- 3955US12237216B2Method for filling recessed features in semiconductor devices with a low-resistivity metalTOKYO ELECTRON LTD·Filed 2022·Granted Feb 25, 2025·0 cites·21 claims
- 4055US2025079174A1Method for processing a substrateTOKYO ELECTION LTD·Filed 2023·Application pending·0 cites
- 4155US2024153770A1Method of Profile Control for Semiconductor ManufacturingTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4254US2020043764A1Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using sameTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 4354US2020006100A1Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using sameTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 4453US12009211B2Method for highly anisotropic etching of titanium oxide spacer using selective top-depositionTOKYO ELECTRON LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 4553US10978307B2Deposition processTOKYO ELECTRON LTD·Filed 2020·Granted Apr 13, 2021·0 cites·20 claims
- 4653US2024405022A1Non-planar transistor structures and methods of manufacturing thereofTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4753US2025138429A1Endpoint detection in dry development of photoresistTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4852US2024087891A1Method for Processing a SubstrateTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4951US12451353B2Double hardmasks for self-aligned multi-patterning processesTOKYO ELECTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 5051US11395687B2Insertion tool for flip anchor cable system insertionDEPUY SYNTHES PRODUCTS INC·Filed 2019·Granted Jul 26, 2022·0 cites·21 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →